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SICK’s CLV600 Series Bar Code Scanners with IP 69K Housing

September 3, 2014 10:15 am | by WDD Staff | Product Releases | Comments

SICK has announced the launch of the CLV600 IP 69K Housing bar code scanners, which provide high read rates in challenging conditions...                                    

LISTED UNDER: Components, Other | Ceramics | Substrates

AI Technology’s Large Area Underfill

August 18, 2014 2:33 pm | by WDD Staff | Product Releases | Comments

AI Technology (AIT) has introduced a new Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices...               

LISTED UNDER: Materials | Ceramics | Substrates

Stainless Steel EtherCAT Box I/O with IP 69K Protection

July 7, 2014 8:49 pm | by WDD Staff | Product Releases | Comments

The new Beckhoff EQxxxx EtherCAT Box I/O series in durable V2A stainless steel housings are rated at protection class IP 69K. As a result, these rugged and robust I/O modules are designed for use directly on machines in application areas...

LISTED UNDER: Ceramics | Substrates
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EMI Shielding Material for Precision Die-Cuts

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Leader Tech has introduced its low compression CFS Conductive Foam Shielding materials to help eliminate unwanted RF and electromagnetic interference from escaping into the surrounding environment from the gaps on electronic enclosures found around the I/O panel, backplane and access panels. CFS Conductive Foam covers these openings with a custom, die-cut shielding gasket...

LISTED UNDER: Interconnect, Cables | Substrates

Xtreme RFID Relies on New Fortron ICE PPS from Celanese

April 21, 2014 11:02 am | by WDD Staff | Product Releases | Comments

Thanks to Fortron ICE polyphenylene sulfide (PPS) from Celanese Corporation, Xtreme RFID is now able to use its proprietary plastic injection molding process to cost effectively manufacture the Allied Series VX-MidTM HT...                    

LISTED UNDER: Ceramics | Substrates

MAST Technologies Offers Customized RF Absorber Samples

March 19, 2014 7:31 pm | by WDD Staff | Product Releases | Comments

RFMW has announced the availability of RF absorber material tuned to customer specific applications...

LISTED UNDER: Ceramics | Substrates

PEM Self-Clinching Fasteners Enable Lighter Designs

February 27, 2014 2:48 pm | by WDD Staff | Product Releases | Comments

Self-clinching fasteners from PEM for use in stainless steel assemblies install reliably and permanently into thin stainless steel sheets and enable lighter designs by minimizing hardware parts count. This growing family of special hardened stainless fasteners includes a wide range of types and styles...

LISTED UNDER: Components, Other | Ceramics | Substrates

High Performance Enclosure Gaskets

February 27, 2014 10:20 am | by WDD Staff | Product Releases | Comments

Leader Tech beryllium-copper fingerstock gaskets are an ideal choice for making reliable electrical contact between parallel seams (mating surfaces) that are created by enclosure access doors and panels. These high-performance, hardened Alloy 25 gasket...                  

LISTED UNDER: Ceramics | Substrates
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GORE Portable Electronic Vent: Highest Airflow, Waterproof Protection

February 25, 2014 5:55 pm | by WDD Staff | Product Releases | Comments

In response to the growing demand for waterproof smart phones and portable electronic devices, W. L. Gore & Associates has expanded the waterproofing solutions in its line of GORE Portable Electronic Vents. The new PE3 Series delivers the highest airflow of black venting solutions for OEMs in this rapidly changing market...

LISTED UNDER: Substrates

Ultra-Low Profile Surface Mount 2032 Coin Cell Holders

February 6, 2014 5:15 pm | by WDD Staff | Product Releases | Comments

When circuit board height is a critical design parameter, Keystone offers a solution with an ultra-low profile holder for the #2032 Lithium Coin Cells...

LISTED UNDER: Ceramics | Substrates | Power, Batteries

Hammond Launches Design-Specific Enclosures for Credit-Card Sized Computers

January 3, 2014 5:09 pm | by WDD Staff | Product Releases | Comments

Hammond Manufacturing has launched a range of design-specific moulded enclosures to support the new types of credit card sized, low cost bare board computers, which typically run Linux. Although broadly similar in size and shape, there are inevitable differences in the positioning of I/O, power and expansion ports on each design...

LISTED UNDER: Ceramics | Substrates

Suppress-n-Sink RF Absorber/Thermally Conductive Pad

December 12, 2013 4:54 pm | by WDD Staff | Product Releases | Comments

RFMW announced design and sales support for a new line of dual use RF Absorber + Thermally Conductive pad material from MAST Technologies. Trademarked Suppress-n-Sink, the target application is reducing harmful reflections from heat-sinks and heat-spreaders...

LISTED UNDER: Ceramics | Substrates

Elma's Custom-designed Type 15i Instrument Case

December 9, 2013 5:37 pm | by WDD Staff | Product Releases | Comments

Elma Electronics introduced a new Type 15i instrument case that is scalable in all three dimensions (H x W x D), while offering designers cost-effective, custom-sized enclosures in relatively small volumes. With virtually infinite scalability in an attractive package, the new enclosure can be sized perfectly to house instruments or small portable devices...

LISTED UNDER: Ceramics | Substrates

MLF / MLFM MELFs Provide Lower Heat Rise

November 26, 2013 5:01 pm | by WDD Staff | Product Releases | Comments

The MLF/MLFM Series surface mount metal film from Stackpole offers cooler operating temperatures at full rated power...

LISTED UNDER: Boards & Modules | Ceramics | Substrates

Thermally-Conductive Polymer from Carbodeon

October 29, 2013 11:29 am | by WDD Staff | Product Releases | Comments

Carbodeon has developed a thermal filler using nanodiamonds that increase the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacture...

LISTED UNDER: IC | Components, Other | Substrates

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