Combination of Materials, Fabrication and Test Expertise Deliver LCP Laminates with Exceptional Performance and Proven Reliability

November 4, 2010 9:46 am | Product Releases | Comments

Endicott Interconnect Technologies, Inc. (EI) announced recently that the company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits....

LISTED UNDER: Substrates | Services, Calibration / Test

Spheric Technologies Produces Lithium Battery Materials Cheaper and Faster with Microwave Furnace Systems

August 30, 2010 10:06 am | Product Releases | Comments

PHOENIX, /PRNewswire/ -- Lithium batteries are playing a central role in the new energy economy, powering everything from cell phones to electric cars. New research shows that pricey lithium battery materials can be produced cheaper and faster using industrial microwave furnace systems. Spheric Technologies, a Phoenix, Arizona, high temperature microwave technology innovator, has developed a time- and cost-saving production process for a...

LISTED UNDER: Substrates | Power, Batteries | Power, Battery

Packages Tout Complete Characterization and Microcharacterization of Carbon Nanomaterials

July 28, 2010 11:11 am | Product Releases | Comments

Thermo Fisher Scientific Inc announced the availability of two new DXR Nanocarbon Analysis Packages for the characterization and microcharacterization of carbon nanomaterials. Both packages offer large-scale chemical and materials producers complete systems for carbon nanotube analysis. Incorporating the Thermo Scientific DXR Raman platform, the packages provide information on the molecular structure and morphology of carbon nanomaterials....

LISTED UNDER: Substrates

DOE Awards Second Contract for Inspection of Infrared Materials and Products

July 22, 2009 9:32 am | Product Releases | Comments

SARASOTA, Fla. and BOLINGBROOK, Ill., /PRNewswire-FirstCall/ -- Sunovia Energy Technologies, Inc. and its partner EPIR Technologies, Inc. announced today the United States Department of Energy has awarded a second contract to EPIR Technologies to provide improved infrared (IR) detectors to be used in a new generation of tools for the inspection and characterization of infrared materials and products....

LISTED UNDER: Substrates

Integrated Receiver Modules Use Low-cost Materials and Automated Processes

May 26, 2009 6:59 am | Product Releases | Comments

MMIC Solutions Ltd. announces the first shipment of its MSx600 range of integrated receiver modules. MMIC Solutions designs and manufactures small, low cost millimeter wave radio products for high capacity communications, security and defense applications. The company's advanced technology allows these products to be manufactured using low-cost circuit board materials and automated processes.

LISTED UNDER: Boards & Modules | Substrates

Advanced Circuit Materials

November 15, 2007 7:48 am | Product Releases | Comments

Rogers Corporation showcased several advanced circuit materials at the 2007 EuMW Week Show. These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets. Products displayed included new Enhanced Copper Bond Technology: This low profile copper technology provides tighter trace width tolerances, lower insertion loss and improved passive intermodulation at high op...

LISTED UNDER: Substrates

LCP-based Circuit Materials

October 3, 2005 9:16 am | Product Releases | Comments

The R/flex® 3000 Family of Liquid Crystalline Polymer (LCP)-based Circuit Materials from Rogers Corporation includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate. R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats....

LISTED UNDER: Substrates

Dielectric Materials

June 2, 2005 7:23 am | Product Releases | Comments

W. L. Gore introduces the MICROLAM® 630 dielectric, low-loss microvia material for high frequency microvia modules and PCBs. This high performance material consists of standard BT resin in a continuous toughening matrix. MICROLAM 630 dielectric provides good thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities and good surface planarization for high-density applications....

LISTED UNDER: Substrates

Light Pipe Materials

October 28, 2003 10:16 am | Product Releases | Comments

BivarOpto introduces an optional, high-contrast material for their light pipe products family. Featuring the use of a 94V-O compliant polycarbonate compound from GE, the light pipes are white-defused in off-state appearance and take full color when in the on-state. The materials are available for the SLP, SP, VLPR and PLP series light pipes and the lens caps in the line of FLP series products....

LISTED UNDER: Substrates

Ceramic Materials

July 8, 2003 11:09 am | Product Releases | Comments

DuPont Microcircuit Materials (MCM) introduces a ceramic solution for embedding resistors and capacitors in PWBs. The Interra™ material system enables circuit board manufacturers to embed high tolerance and reliable thick film resistors along with high density capacitors within the layers of multilayer boards using a simple and cost-effective process....

LISTED UNDER: Substrates

Electrical Performance of Microvia PCB Materials

March 28, 2003 9:41 am | Product Releases | Comments

Substrates based on FR4 core constructions utilizing low loss microvia dielectrics can offer low cost, high performance. By Dr. Gregg S. Wildes and John Mosko, W. L. Gore & Associates, Inc. High density module substrate and PCB requirements are driving the need for high density interconnect (HDI) design capabilities using laser microvias (note that "HDI", "high density", and "microvia" are often used synonym...

LISTED UNDER: Substrates

Ferrite Materials

February 25, 2003 12:07 pm | Product Releases | Comments

The P1 and P2 Series are available in a range of core shapes and sizes for use in high power system functions. Both materials are specifically designed for applications requiring low power loss in the frequency range of 25 kHz - 200 kHz and are optimized for operating at temperatures between 80°DC - 100°C....

LISTED UNDER: Substrates

Potting Materials

January 27, 2003 9:47 am | Product Releases | Comments

A new line of two-part UV curing potting compounds called Trigger Cure™ have an instant UV curing feature, with the ability to cure at room temperature to depths of an inch or more, and in areas under components where the light does not reach. The 1:1 two-component products are designed for ease of application through typical disposable tip static mix dispensers....

LISTED UNDER: Substrates

Thick Film Materials

December 26, 2002 8:45 am | Product Releases | Comments

This complete system of thick film materials is specifically designed for Aluminum Nitride substrates. The use of thick film on AlN substrates enables low cost, high volume manufacture of small modules and power resistors for base stations in the telecommunications market. They also offer packaging options for high-power devices required for 42-volt automotive systems....

LISTED UNDER: Substrates

Liquid Crystalline Polymer Materials

February 27, 2002 9:34 am | Product Releases | Comments

Rogers introduced the first of its new ZYVEX™ liquid crystalline polymer circuit materials. Rogers ZYVEX TeraClad™ material is a single-clad laminate, developed primarily for flexible circuit applications. ZYVEX is designed to meet today's industry requirements for low/stable dielectric constant, low/stable dielectric loss, extremely low moisture absorption, high chemical resistance, matched in-plane CTE, and excellent dimensional s...

LISTED UNDER: Substrates


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