Stackpole’s RNCP Series for High Power Anti-Sulfur Applications

May 13, 2013 4:04 pm | by WDD Staff | Product Releases | Comments

The RNCP series from Stackpole has no silver or other susceptible metals in the terminations to cause sulfur contamination. Additional features include applicability in automotive and industrial control applications, construction and heavy equipment, power supplies, and anywhere sulfur contamination is a concern.

LISTED UNDER: Components, Other | Interconnect, Connectors | Switches, IC

DELO Light Curing Adhesives

May 13, 2013 11:57 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

DELO Industrial Adhesives’ new light curing DELO-KATIOBOND product lineup has been engineered specifically for exceptionally fast seal-bonding functions in the production of microelectronics including micro switches widely used in the automobile industry.

LISTED UNDER: Ceramics | Substrates | Switches, IC

Stackpole’s RC Series Carbon Comps

May 10, 2013 10:01 am | by WDD Staff | Product Releases | Comments

Stackpole’s RC series is an axial leaded carbon composition technology available in ¼, ½, and 1 W power ratings. Additional features include a dense carbon slug element that handles high-energy surges, availability in values from to 1 Ω to 22 MΩ and tolerances of 5% and 10%. 

LISTED UNDER: Ceramics | Substrates

GORE Automotive Vents Protect Powertrain Components

April 30, 2013 9:52 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

W. L. Gore & Associates has expanded its line of GORE Automotive Vents to include the new Series: AVS 41 (P/N VE2048) venting solution, which is engineered specifically for powertrain components. This new vent improves component reliability by equalizing pressure, preventing contamination from water...

LISTED UNDER: Components, Other | Ceramics | Substrates

New GAW113 acoustic vent from W. L. Gore & Associates

April 23, 2013 9:59 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

The new GAW113 acoustic vent from W. L. Gore & Associates’ Portable Electronic Vents group is designed to provide dust and splash protection for acoustic openings in portable electronic devices such as scanners, two-way radios, tablet and laptop PCs...

LISTED UNDER: Ceramics | Substrates | Transmission, Other

Maxim's Bits for Tuner for DAB

April 16, 2013 9:33 am | by WDD Staff | Product Releases | Comments

Maxim Integrated Products, Inc. [NASDAQ: MXIM] has announced the MAX2173 RF to Bits tuner for digital audio broadcast (DAB) applications in automobiles and other mobile DAB/FM products. The RF to Bits DAB/FM tuner integrates a radio tuner.

LISTED UNDER: Boards & Modules | Mixers, Microwave / RF / IF | Receivers, RF / Microwave

Tuned Frequency Absorbers from RFMW

April 8, 2013 10:55 am | by WDD Staff | Product Releases | Comments

RFMW Ltd. has announces design and sales support for a new line of microwave absorbing materials from MAST Technologies. These “Tuned Frequency” absorbers are electrically optimized for specific applications and intended for customers who experience high-frequency...

LISTED UNDER: Boards & Modules | Ceramics | Substrates

Cascade's Flexible On-Wafer Measurement Platform

March 18, 2013 11:18 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Cascade Microtech, Inc. has announced the CM300, a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity.

LISTED UNDER: Computing | Ceramics | Substrates

Metallized Carbon's New Silver Metcar

March 13, 2013 10:27 am | by WDD Staff | Product Releases | Comments

Metallized Carbon Corporation has announced that it produces Silver Metcar, a silver impregnated, carbon-graphite material useful for electrical applications that require low resistance, low voltage drop, and low electrical noise. The material is ideal for DC motor...

LISTED UNDER: Ceramics | Substrates

Fujipoly’s New Form-in-Place Thermal Compound

March 5, 2013 10:52 am | by WDD Staff | Product Releases | Comments

Fujipoly has announced the introduction of SARCON SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 3.0 mm in height.

LISTED UNDER: Ceramics | Substrates

Rogers' Next Gen RO4000 Materials

February 21, 2013 8:36 am | by WDD Staff | Product Releases | Comments

Rogers Corporations [NYSE:ROG] next generation RO4000 materials, RO4835 high-frequency laminates, specially formulated with improved oxidation resistance were developed for applications needing a special level of electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. 

LISTED UNDER: Ceramics | Substrates

ERGO-CASE ‘XS’ - OKWs Wearable Small Hand Held Enclosures

February 19, 2013 9:20 am | by WDD Staff | Product Releases | Comments

OKW Enclosures has extended its advanced ERGO-CASE enclosures system with six new smaller size ‘XS’ models. The new models are ideal for compact hand held electronic devices, and have an ergonomically contoured design, which is very comfortable to hold or wear.

LISTED UNDER: Ceramics | Substrates

Saelig Introduces BoardMaster Universal PCB Test System

January 30, 2013 10:22 am | by WDD Staff | Product Releases | Comments

Saelig Company, Inc. has introduced the ABI BoardMaster 8000 PLUS - a unique, versatile, self-contained, and easy-to-use PCB test system. The BoardMaster 8000 Plus is a comprehensive set of test instruments, complete with built-in PC, for testing and fault-finding on almost any kind of PCB.

LISTED UNDER: Ceramics | Substrates | Test and Measurement, Analyzers, Spectrum

Fujipoly’s Thermal Gel Sheets

January 30, 2013 9:52 am | by WDD Staff | Product Releases | Comments

Fujipoly (Carteret, NJ) has announced the availability of Sarcon 50GR-Ae, an extremely soft, .5 mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.

LISTED UNDER: Boards & Modules | Ceramics | Substrates

Halogen-free Theta circuit materials ideally suited for high-speed digital circuits

August 9, 2012 7:49 am | Product Releases | Comments

  Rogers Corporation  will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference ) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.

LISTED UNDER: Substrates


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