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Tuned Frequency Absorbers from RFMW

April 8, 2013 10:55 am | by WDD Staff | Product Releases | Comments

RFMW Ltd. has announces design and sales support for a new line of microwave absorbing materials from MAST Technologies. These “Tuned Frequency” absorbers are electrically optimized for specific applications and intended for customers who experience high-frequency...

LISTED UNDER: Boards & Modules | Ceramics | Substrates
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Cascade's Flexible On-Wafer Measurement Platform

March 18, 2013 11:18 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Cascade Microtech, Inc. has announced the CM300, a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity.

LISTED UNDER: Computing | Ceramics | Substrates

Metallized Carbon's New Silver Metcar

March 13, 2013 10:27 am | by WDD Staff | Product Releases | Comments

Metallized Carbon Corporation has announced that it produces Silver Metcar, a silver impregnated, carbon-graphite material useful for electrical applications that require low resistance, low voltage drop, and low electrical noise. The material is ideal for DC motor...

LISTED UNDER: Ceramics | Substrates

Fujipoly’s New Form-in-Place Thermal Compound

March 5, 2013 10:52 am | by WDD Staff | Product Releases | Comments

Fujipoly has announced the introduction of SARCON SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 3.0 mm in height.

LISTED UNDER: Ceramics | Substrates

Rogers' Next Gen RO4000 Materials

February 21, 2013 8:36 am | by WDD Staff | Product Releases | Comments

Rogers Corporations [NYSE:ROG] next generation RO4000 materials, RO4835 high-frequency laminates, specially formulated with improved oxidation resistance were developed for applications needing a special level of electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. 

LISTED UNDER: Ceramics | Substrates

ERGO-CASE ‘XS’ - OKWs Wearable Small Hand Held Enclosures

February 19, 2013 9:20 am | by WDD Staff | Product Releases | Comments

OKW Enclosures has extended its advanced ERGO-CASE enclosures system with six new smaller size ‘XS’ models. The new models are ideal for compact hand held electronic devices, and have an ergonomically contoured design, which is very comfortable to hold or wear.

LISTED UNDER: Ceramics | Substrates

Saelig Introduces BoardMaster Universal PCB Test System

January 30, 2013 10:22 am | by WDD Staff | Product Releases | Comments

Saelig Company, Inc. has introduced the ABI BoardMaster 8000 PLUS - a unique, versatile, self-contained, and easy-to-use PCB test system. The BoardMaster 8000 Plus is a comprehensive set of test instruments, complete with built-in PC, for testing and fault-finding on almost any kind of PCB.

LISTED UNDER: Ceramics | Substrates | Test and Measurement, Analyzers, Spectrum

Fujipoly’s Thermal Gel Sheets

January 30, 2013 9:52 am | by WDD Staff | Product Releases | Comments

Fujipoly (Carteret, NJ) has announced the availability of Sarcon 50GR-Ae, an extremely soft, .5 mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.

LISTED UNDER: Boards & Modules | Ceramics | Substrates

Halogen-free Theta circuit materials ideally suited for high-speed digital circuits

August 9, 2012 7:49 am | Product Releases | Comments

  Rogers Corporation  will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference ) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.

LISTED UNDER: Substrates

Renewable Raw Materials - The Future of Plastic Enclosures

February 3, 2012 3:40 am | Product Releases | Comments

On request, OKW now offers its design-oriented standard plastic enclosures in a bioplastic material. This biomaterial is entirely manufactured from renewable raw materials and is formulated to replace the fossil plastics currently being used. Unlike conventional raw materials, bioplastics are largely CO2-neutral, irrespective of their subsequent utilization.

LISTED UNDER: Substrates

Application and Theory of Dielectric Materials in RF/Microwave Systems

January 18, 2012 5:50 am | Product Releases | Comments

Maxwell’s equations define two terms which determine the response of a material to electromagnetic fields. These are the electric permittivity e and the magnetic permeability µ. If these quantities are known for a material, then the reaction of a wave to the material is completely determined. The permeability is a measure of a material’s response to the magnetic portion of an EM wave....

LISTED UNDER: Substrates

Poly-Form Flexible Pre-shaped Adhesives for Bonding Diverse Materials

September 2, 2011 8:44 am | Product Releases | Comments

Multi-Seals has introduced an innovative alternative to liquid adhesives for component assembly. Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. F05 has negligible vertical flow, which keeps the adhesive contained in precisely defined areas.

LISTED UNDER: Substrates

Antenna-Grade Materials Solutions will Showcase at Antenna Systems 2011

August 31, 2011 7:26 am | by Edited Janine E. Mooney, Associate Editor | Product Releases | Comments

Rogers Corporation will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2011 Conference and Expo September 20-21, at the Gaylord Opryland Hotel, Nashville, TN. Antenna Systems 2011 is a leading international conference and exhibition devoted to antenna designers, manufacturers, and system integrators focusing on the latest advances in antenna systems and technology.

LISTED UNDER: Substrates

New Phase Change Material Expands Company’s Thermal Interface Materials Product Line

April 22, 2011 7:31 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....

LISTED UNDER: Substrates

New Phase Change Material Expands Company’s Thermal Interface Materials Product Line

April 22, 2011 7:31 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....

LISTED UNDER: Substrates

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