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IEEE ICC 2013 to Explore Latest Advances for “Bridging the Broadband Divide” in Budapest, Hungary from June 9 – 13

March 21, 2013 1:19 pm | by IEEE International Conference on Communications | News | Comments

The IEEE International Conference on Communications (ICC 2013), the leading international venue dedicated to the advancement of wireless and wireline communications worldwide, will hold its next annual event in the Central European cultural and industrial center of Budapest Hungary...

Engineering Newswire 30: Augmented Reality Recognizes Your Friends

March 21, 2013 10:08 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | Comments

Today on Engineering Newswire, brought to you by Interpower, the premier supplier of power system components for worldwide markets, we’re testing experimental grasshopper rockets, making smooth jazz on the seaboard, and making the Sphero do everything.

Internet Connected Devices Surpass Half a Billion in U.S. Homes

March 20, 2013 12:19 am | by C0nnected Intelligence; NPD Group | News | Comments

There are now more than half a billion devices in U.S. homes that are connected to the Internet and deliver apps, according to new findings from the Connected Intelligence Connected Home Report from global information company The NPD Group. Increases in tablet and smartphone...

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Tektronix Demonstrates MIPI Alliance M-PHY Test Solution

March 19, 2013 2:48 pm | by Tektronix, Inc. | News | Comments

Tektronix, Inc. has announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices.

IEEE OnlineGreenComm 2013 to be held October 29 - 31

March 19, 2013 2:12 pm | by IEEE | News | Comments

IEEE Online Conference on Green Communications (OnlineGreenComm 2013), the virtual forum dedicated to the advancement of energy-efficient communications and green networking technologies, will hold its third annual event from October 29 - 31, 2013.

AVX’S Tantalum Corporation Receives ISO 13485 Certification

March 18, 2013 6:49 pm | by AVX Corporation | News | Comments

“All AVX plants are committed to producing the highest quality components, operating in a safe and environmentally responsible manner, and continually improving manufacturing processes, efficiency, and product quality,” says Bob Fairey, General Manager, AVX Tantalum Corporation. 

HotSpot Episode 3: Eye-Tracking Technology

March 11, 2013 9:26 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | Comments

This week on WDD's Hotspot, Samsung's new Galaxy S IV will feature eye-tracking technology; Overdrive Robotics' smartbot is a smartphone and robot in one; LIFEBeam engineers create heart rate-monitoring SMART bicycle helmet; and Thimble Bioelectronics provides portable pain relief.

IEEE OnlineGreenComm 2013 to be held October 29 - 31

March 10, 2013 11:46 pm | by IEEE Online Conference on Green Communications | News | Comments

IEEE Online Conference on Green Communications (OnlineGreenComm 2013), the virtual forum dedicated to the advancement of energy-efficient communications and green networking technologies, will hold its third annual event from October 29 - 31, 2013.

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CTS Introduces an Ultra-Low Power Shock Resistant OCXO

March 7, 2013 11:29 am | by WDD Staff | Product Releases | Comments

CTS Electronic Components, Incorporated [NYSE: CTS] has announced development of Model 148, oven controlled crystal oscillator (OCXO), which uses the unique SC cut crystal technology to significantly reduce power consumption down to 0.23 W at +25°C.

Texas Instruments & 4DSP Collaborate on FPGA Mezzanine Card

March 5, 2013 3:46 pm | by Texas Instruments Incorporated | News | Comments

With TI’s high-performance C6678 multicore DSP, the FMC667 is able to more effectively and rapidly meet the essential requirements of Commercial Off-The-Shelf (COTS)-based systems, as well as increase processing power, accuracy and finer resolution in mission critical and industrial applications.

CTS Introduces an Ultra-Low Power Shock Resistant OCXO

March 5, 2013 3:24 pm | by WDD Staff | Podcasts | Comments

CTS Electronic Components, Incorporated [NYSE: CTS] has announced development of Model 148, oven controlled crystal oscillator (OCXO), which uses the unique SC cut crystal technology to significantly reduce power consumption down to 0.23 W at +25°C.

Stackpole's KAL Series Wirewound Resistor

February 25, 2013 11:25 am | by WDD Staff | Product Releases | Comments

The KAL Series from Stackpole is a wirewound resistor technology utilizing a large ceramic core molded in aluminum housing for superior heat transfer. The KAL Series can be tailored to many different types of requirements such as low inductance, non-inductively wound, high surge, high voltage, and fusibility in addition to different types of terminations such as tabs, flying leads, and crimped connectors.

Sierra Wireless Introduces AirPrime Wireless Modules

February 25, 2013 11:17 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Sierra Wireless [NASDAQ: SWIR] has introduced the industry’s most advanced architecture for embedded wireless communications, designed to vastly simplify and accelerate the development and deployment of M2M solutions. The architecture will be available across 2G to 4G technologies in the next generation of AirPrime embedded wireless modules.

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Increased Performance in RF/IF Signal Recorders

February 25, 2013 11:14 am | by WDD Staff | Product Releases | Comments

Pentek, Inc. has announced rackmount additions to its Talon RF/IF signal recording and playback systems. The Model RTS 2707 rackmount system and Model RTR 2747 rugged rackmount system, offer recording and playback of RF/IF signals up to 700 MHz with signal bandwidths up to 200 MHz.

Pulse Electronics Introduces Ultra-thin NFC Ferrite Sheet Antenna

February 25, 2013 11:12 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Pulse Electronics Corporation [NYSE: PULS] has introduced a near field communications (NFC) antenna that is 40% thinner than similar NFC ferrite sheet antennas, while still complying with the EMVCo specification. The new ferrite sheet antenna is constructed of a thin ferrite with one-sided flex and a thinner adhesive.

Next-Generation SiGe Technology for High Volume Consumer RF Applications

May 26, 2010 9:09 pm | News | Comments

TowerJazz announced design kit availability for its next-generation 130 nm SiGe BiCMOS technology (SBL13) for high volume consumer RF applications. The SBL13 process combines SiGe bipolar performance with a mature 130 nm CMOS copper (Cu) backend to achieve high performance RF with more integrated digital logic.

Noise Extended Technologies Exhibits High-Performance Phase Noise Products

May 26, 2010 8:29 pm | News | Comments

Noise Extended Technologies S.A.S. (Noise XT) made its own U.S. debut at the International Microwave Symposium this week. This is the first public exhibition by Noise XT since the buy-out by employees of Aeroflex-Europtest, Elancourt, France. Noise XT exhibited its well-known phase noise product line.

Integrated RF Capture/Playback Solution

May 26, 2010 8:05 pm | News | Comments

X-COM Systems, LLC is now offering its integrated RF capture playback solution. Long duration RF storage and playback is proving to be an essential new tool for addressing today’s electronic warfare and surveillance challenges. It offers the ability to re-create complex signal environments, de-bug complex signal situations, and often reduces the overall cost of system test.

High Performance C-Band Devices Optimized for both High Gain and Power Added Efficiency

May 26, 2010 8:04 pm | News | Comments

Toshiba America Electronic Components, Inc. (TAEC*) and its parent company, Toshiba Corporation, announced the expansion of its gallium arsenide field effect transistor (GaAs FETs) lineup with a new “EL” series of high performance C-Band devices optimized for both high gain and power added efficiency.

Advanced Copper on Silicon Process Supported by Design Tools and Rapid Prototyping

May 26, 2010 8:04 pm | News | Comments

ON Semiconductor introduces a new integrated passive device (IPD) process technology. An enhancement of the company’s existing HighQ™ copper (Cu) on silicon (Si) IPD technology, the new IPD2 process features a second 5 um copper layer that increases inductor performance, allows greater flexibility and supports the design of highly precise, cost-effective IPDs for RF system in package applications in portable electronics equipment.

National Instruments Advances IEEE 802.11n Wireless LAN Test with WLAN Measurement Suite 2.0

May 26, 2010 8:03 pm | News | Comments

National Instruments announced the availability of its new solution for IEEE 802.11n wireless LAN (WLAN) testing, the NI WLAN Measurement Suite 2.0, which includes enhanced software toolkits for IEEE 802.11n WLAN signal generation and analysis. The suite integrates with NI 6.6 GHz PXI Express multichannel RF signal generators and analyzers to deliver true, phase-coherent multiple-input, multiple-output (MIMO) RF measurements required for IEEE 802.

AWR 2010 Release

May 26, 2010 8:03 pm | News | Comments

AWR Corporation is showcasing the 2010 release of its product line at IMS 2010 (Booth #1318). This release includes enhancements to Microwave Office® high-frequency design software, AXIEM™ 3D planar electromagnetic (EM) analysis software, and Visual System Simulator™ (VSS) communication system design and optimization software.

Complete RF Front-End Solution for Point-to-Point Radio Markets

May 26, 2010 8:02 pm | News | Comments

Avago Technologies announced early prototypes have been manufactured for Avago’s proprietary five-chip family that targets the expanding 38 GHz and 42 GHz cellular radio infrastructure and backhaul point-to-point radio markets. Based on market demand and customer feedback, Avago designed the millimeter wave products for high performance in Surface Mount Technology (SMT) packages.

First European-Flow UltraCMOS™ RF ICs Deliver -216 dBc/Hz/Hz with Ultra-Low Power

May 25, 2010 10:59 pm | News | Comments

Peregrine Semiconductor Corporation has released two new devices in its Phase-Locked Loop (PLL) Frequency Synthesizer family. These UltraCMOS™ RFIC devices fulfill the need for low-power, ultra-low phase noise, multiple-way programmable PLL solutions for capability of the military, broadband cable infrastructure, and wireless infrastructure markets.

Mid- and High-Power WiFi Power Amplifier Solutions Ideally Suited for 802.11n Access Points, Routers and Gateways

May 25, 2010 10:49 pm | News | Comments

Skyworks Solutions, Inc. introduces new mid- and high-power (2.4 to 2.5 GHz), highly efficient power amplifiers (PAs) for 802.11n multiple in/multiple out (MIMO) access points, routers and gateways. These high-performance, small form factor solutions enable multiple-transmit channels on printed circuit boards (PCBs), offering customers valuable configuration space savings.

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