IMS 2012 in Montreal caused quite a stir, in more ways than one. Exhibitors and attendees alike complained of extensive lines at customs, and some exhibitors even turned back after having issues getting their booth materials across the border. Those of us who did find our feet on Canadian land, perusing the exciting new products and technologies that lined the show floor were very happy with the outcome.
The new IEEE 802.11ac WLAN standard will provide an unprecedented high data throughput of 1 Gbit/s and higher. It is still being defined, but developers who want to design chipsets and modules in line with IEEE 802.11ac today can now use the R&S FSW to analyze WLAN signals over the full bandwidth – with unparalleled accuracy.
Teseq, a leading developer and provider of instrumentation and systems for EMC emission and immunity testing, intends to acquire New York-based Instruments for Industry (IFI), a leading designer and manufacturer of solid state and traveling wave tube (TWT) amplifiers. By combining the competencies of IFI and the recently acquired MILMEGA with its own capabilities, Teseq will expand its expertise and broaden its product line in the RF amplifier market.
Peregrine Semiconductor announced from booth # 2009 at the International Microwave Symposium (IMS2012) in Montreal, the SP4T PE42540 RF switch. Designed on the latest UltraCMOS® process technology version, STeP5, the HaRP™ technology-enhanced PE42540 switch has a frequency range of 10 Hz to 8 GHz, with low insertion loss of 0.
Rogers Corporation and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials. The 2012 IEEE International Microwave Symposium ( www.
Richardson RFPD announces immediate availability and full design support capabilities for a new family of gallium nitride (GaN) on silicon carbide (SiC), high electron mobility transistor (HEMT), radio frequency (RF) transistors from Microsemi Corporation (Microsemi). The common source GaN on SiC transistors are internally-matched for optimal performance and specifically designed for S-band radar applications, making them easier to design-in than unmatched broadband devices.
RF Micro Devices, Inc. today announced the release of the RFHA1025, a highly-efficient 280-watt pulsed gallium nitride (GaN) RF matched power transistor. The RFHA1025 delivers superior performance versus competing silicon power technologies. RFMD’s RFHA1025 complements the recently released 380-watt RF3928B, the highest output power S-Band device in RFMD’s matched power transistor family.
Computer Simulation Technology AG (CST) announces enhancements to the transient solver of CST MICROWAVE STUDIO® at MTT-S IMS 2012. There is an increasing need to model ever more complex devices more realistically. This helps avoid additional cost and time intensive prototyping cycles but can put a great strain on computational resources.
Aeroflex Limited announced today that it has added IEEE 802.11ac capability to its S-Series RF signal generator and analyzer product line. First introduced in 2010, the S-Series offers top-of-the-range performance at a mid-range price. Designed for use by engineers in wireless local area network (WLAN) research, design, and manufacturing, the new 802.
At IMS booth #1129 in Montreal, Canada, Vaunix Technology Corporation will be offering demos of their new LSW Series Switches and new models in their family of LDA Series Digital Attenuators. The switch line is a new Lab Brick product family offering 10 W power handling capability and reliable, high isolation, low power solid state switching in both single pole double throw (SPDT) and single pole four throw (SP4T) configurations.
Rugged High-Frequency Low Noise RF Transistors Meet Demanding Requirements of 5 GHz Wireless ApplicationsJune 19, 2012 5:16 am | News | Comments
At the IEEE MTT-S International Microwave Symposium today, Infineon Technologies AG launched a new SiGe:C (Silicon-Germanium: Carbon) HBT (hetero-junction bipolar transistor) device series for Low Noise Amplifier (LNA) applications. The new BFx840xESD series is particularly well-suited for design of consumer wireless products operating in the 5-6 GHz range, including current and next generation WiFi® access points and modules.
Crystek Crystals Corporation has launched the CVSS-945 – a True SineWave Voltage Controlled Crystal Oscillator (VCXO) providing -172.9 dBc/Hz noise floor at 1 MHz offset and +/-20 ppm min. APR pullability. This high-performance VCXO is available in the industry standard 9x14mm SMD package and is engineered to MIL-STD-883 and MIL-STD-202 specifications.
RF power market leader Freescale Semiconductor has introduced new Airfast™ transistors engineered to boost the efficiency, peak power and signal bandwidth of next-generation base stations. With the new offerings, Freescale’s flagship Airfast RF power product line now includes at least one solution for each cellular band and supports both small and large cell base station deployments.
Avnet Electronics Marketing Americas today announced that order entry is now open for the Zynq™-7000 Extensible Processing Platform (EPP) and Analog Devices, Inc.(NASDAQ: ADI) Software-Defined Radio Kit . Designed by Avnet and Analog Devices engineers, this kit offers engineers a proven platform to test, design and deliver a wide range of wireless communication functions; from baseband to radio-frequency (RF).
At this year's IEEE MTT-S International Microwave Symposium (IMS2012) held June 17-22 in Montreal, Canada, Analog Devices, Inc . (ADI), will present the newest members of its portfolio of RF ICs designed to advance radio architectures in a broad array of applications. At Booth #1725 , Analog Devices will demonstrate a complete line-up of high-performance RF ICs, including data converters, amplifiers, phase-locked loops (PLLs) direct digital synthesis (DDS) ICs, integrated RF ICs, microwave technology as well as a new Software Defined Radio (SDR) FPGA mezzanine card (FMC) that allow engineers to quickly combine high-speed analog and high-performance digital circuitry.
Analog Devices Unveils Industry's Fastest 12-bit, Direct Digital Synthesizers for Frequency-Agile Wireless ApplicationsJune 18, 2012 8:10 am | News | Comments
Meeting the demand for direct digital synthesis (DDS) technology that meets the needs of wireless applications requiring fast hopping and/or sweeping, Analog Devices, Inc. (ADI) today announced that it has more than tripled the clock speed of previously available DDS integrated circuits (ICs). Coupled with an on-chip, high-speed, 12-bit D/A converter, ADI's AD9914 achieves a speed of 3.
Analog Devices, Inc. (ADI) today announced the industry’s highest performance 13 GHz PLL synthesizer. The ADF4159 achieves breakthrough phase detector operating frequency of 110 MHz and simultaneously consumes less than 100 mW of power, which is 5 times less than competitive solutions. In addition, the ADF4159 contains a 25-bit fixed modulus as well as on-chip functionality to generate highly linear ramp profiles, making it an ideal solution for Frequency Modulated Continuous Wave (FMCW) radar applications, including automotive radar systems, microwave Point-to-Point (PtP) systems, communications instrumentation and test equipment.
Dual, 16-Bit, 1.25-GSPS, Digital-to-Analog Converter IC Incorporates a JESD204 Serial Input to Simplify the FPGA InterfaceJune 18, 2012 7:44 am | News | Comments
Analog Devices, Inc. ( ADI ) today introduced the AD9128, a performance-leading 16-bit, 1.25-GSPS transmit D/A converter (DAC) with integrated complex digital modulation functionality, and featuring a JESD204A-compatible serial input. The AD9128’s high-speed serial interface greatly simplifies and improves the data connection between the DAC and the FPGA in a typical system implementation.
In IMS booth #3513 in Montreal, Canada this week, KCB, an AS-9100 certified designer and manufacturer of hi-rel SMT devices, is introducing some of their most recent semiconductor packaging techniques. One such technique, recently employed for a military customer in the AESA radar market, was a custom hermetic device that included two chips, a driver, on-board DPS, a DVA capability, and a PA stage.
RF Micro Devices, Inc. today announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD(R) RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.
In IMS Booth # 301 in Montreal, Canada next week, SemiGen, Inc., an RF/Microwave assembly and automated PCB manufacturing house, will be showcasing their new RF Supply Center, an online source for bonding supplies, materials, and tools. The center offers immediate shipment of low volumes of popular epoxies, adhesive films, bonding tools, gold wire and other supplies used in die attach, substrate attach, chip bonding, assembly, screen printing, and surface mounting of microwave modules and components.
More than 560 companies from all over the world will convene in Montreal June 17-22 for the IEEE MTT-S 2012 International Microwave Symposium (IMS2012) . IMS2012’s theme, “Microwaves without Borders” is evident through the diversity in the exhibiting organizations, which hail from 21 different countries.
Vishay Intertechnology, Inc today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) offering high self resonance, a high Q factor of ? 2000, and a low dissipation factor of ? 0.05 % for operation in high-frequency commercial applications. With their low dissipation factor, devices in the VJ HIFREQ series are optimized for filter and matching networks, and amplifier and DC blocking circuits.
IMS2012 is a unique opportunity for us to show you our fantastic city. Montreal is an international metropolis, the world’s second-largest French-speaking city after Paris, and home to 3.7 million people representing no fewer than 80 cultural groups. Each year, this compact and green island gem welcomes thousands of visitors who come here to enjoy its combination of old world charm and new world verve.
Vishay Intertechnology announced that it will be showcasing the company's latest industry-leading wire-bondable and ceramic thin film products, as well as its multi-layer ceramic chip capacitors (MLCCs), at the 2012 IEEE MTT-S International Microwave Symposium (IMS), being held from June 19-21 at the Montreal Convention Center.