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Dual, 16-Bit, 1.25-GSPS, Digital-to-Analog Converter IC Incorporates a JESD204 Serial Input to Simplify the FPGA Interface

June 18, 2012 7:44 am | News | Comments

Analog Devices, Inc. ( ADI ) today introduced the AD9128, a performance-leading 16-bit, 1.25-GSPS transmit D/A converter (DAC) with integrated complex digital modulation functionality, and featuring a JESD204A-compatible serial input. The AD9128’s high-speed serial interface greatly simplifies and improves the data connection between the DAC and the FPGA in a typical system implementation.

New Concepts in Semiconductor Packaging at IMS

June 18, 2012 7:25 am | News | Comments

In IMS booth #3513 in Montreal, Canada this week, KCB, an AS-9100 certified designer and manufacturer of hi-rel SMT devices, is introducing some of their most recent semiconductor packaging techniques. One such technique, recently employed for a military customer in the AESA radar market, was a custom hermetic device that included two chips, a driver, on-board DPS, a DVA capability, and a PA stage.

Industry-Best WiFi Front End Modules at IEEE International Microwave Symposium (IMS) 2012

June 18, 2012 7:18 am | News | Comments

RF Micro Devices, Inc. today announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD(R) RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.

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SemiGen to Showcase New RF Supply Center at IMS

June 18, 2012 6:47 am | News | Comments

In IMS Booth # 301 in Montreal, Canada next week, SemiGen, Inc., an RF/Microwave assembly and automated PCB manufacturing house, will be showcasing their new RF Supply Center, an online source for bonding supplies, materials, and tools. The center offers immediate shipment of low volumes of popular epoxies, adhesive films, bonding tools, gold wire and other supplies used in die attach, substrate attach, chip bonding, assembly, screen printing, and surface mounting of microwave modules and components.

International Exhibitors to Convene at IMS2012

June 18, 2012 5:58 am | News | Comments

More than 560 companies from all over the world will convene in Montreal June 17-22 for the IEEE MTT-S 2012 International Microwave Symposium (IMS2012) . IMS2012’s theme, “Microwaves without Borders” is evident through the diversity in the exhibiting organizations, which hail from 21 different countries.

Vishay Intertechnology Releases High-Frequency RF and Microwave Multi-Layer Ceramic Capacitors

June 18, 2012 5:47 am | News | Comments

Vishay Intertechnology, Inc today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) offering high self resonance, a high Q factor of ? 2000, and a low dissipation factor of ? 0.05 % for operation in high-frequency commercial applications. With their low dissipation factor, devices in the VJ HIFREQ series are optimized for filter and matching networks, and amplifier and DC blocking circuits.

IMS 2012: Travel Reminders

June 15, 2012 10:22 am | News | Comments

IMS2012 is a unique opportunity for us to show you our fantastic city. Montreal is an international metropolis, the world’s second-largest French-speaking city after Paris, and home to 3.7 million people representing no fewer than 80 cultural groups. Each year, this compact and green island gem welcomes thousands of visitors who come here to enjoy its combination of old world charm and new world verve.

Industry-Leading Wire-Bondable, Ceramic Thin Film, and MLCC Products at IMS 2012

June 15, 2012 10:18 am | News | Comments

Vishay Intertechnology announced that it will be showcasing the company's latest industry-leading wire-bondable and ceramic thin film products, as well as its multi-layer ceramic chip capacitors (MLCCs), at the 2012 IEEE MTT-S International Microwave Symposium (IMS), being held from June 19-21 at the Montreal Convention Center.

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Portable, Multi-Channel RF Recorder for GNSS Applications

June 15, 2012 9:59 am | News | Comments

Averna announces the availability of a field-ready multi-channel RF Recorder for RF applications covering 330 MHz to 2.5 GHz. The Averna RP-5300 RF Recorder is an advanced tool for both field testing and performance testing. With 50 MHz of recording bandwidth at 16-bits, it can record multiple GNSS signals in up to two bands (L1, L2, L5), such as GPS or GLONASS.

Magnetic Field Coil Generates Fields Up To 1200 A/m

June 15, 2012 9:44 am | News | Comments

Teseq offers a new magnetic field coil that generates fields up to 1200 A/m during magnetic field testing.  The INA 703 is designed for testing to IEC 61000-4-8 (supply frequency magnetic fields), IEC 61000-4-9 (pulsed magnetic fields) and IEC 61000-4-10 (oscillatory magnetic fields) standards.

GaN RF MMIC Process Technologies Enable Lower Cost, Higher Performance

June 15, 2012 9:11 am | News | Comments

Cree introduces the new 40 Volt, 0.25um GaN-on-SiC HEMT process die product family to deliver revolutionary power and bandwidth capabilities through Ku Band. The innovative product family enables the replacement of Travel-Wave Tubes with solid-state amplifiers for improved efficiency and reliability.

Nujira Pushes the Envelope with ET Surface Explorer

June 15, 2012 9:03 am | News | Comments

Nujira Ltd launched ET Surface Explorer, an advanced measurement and data visualization tool for characterizing RF power amplifiers (PAs) in ET mode. ET Surface Explorer is a software upgrade to Nujira’s existing NCT-T9102 RF PA characterization system. It accelerates PA characterization, provides PA and product designers greater insight into the performance of ET PAs, and enables them to maximize the linearity, efficiency and output power benefits of operating PAs in ET mode.

Hittite to Feature 24 New Products at IMS 2012!

June 15, 2012 8:18 am | News | Comments

Hittite Microwave Corporation will feature 24 new products at the 2012 IEEE MTT-S International Microwave Symposium (IMS 2012) and Exhibition held at the Palais des Congres, Montreal, Canada, June 19-21 2012. During the exhibition, these and other Hittite Microwave products will be on display. A live product demonstration area will showcase some of the company’s latest products in our 20’ x 30’ corporate exhibit, booth #1701.

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World's Only Broadband VNA System for On-wafer Characterization

June 15, 2012 8:09 am | News | Comments

Anritsu Company announces it will demonstrate the world’s only broadband Vector Network Analyzer (VNA) system that can conduct single sweeps from 70 kHz to 140 GHz in its booth (#807) at the International Microwave Symposium (IMS), to be held June 19-21, in Montreal. The on-wafer device characterization is one in a series of demonstrations to be conducted in Anritsu’s booth that will highlight test solutions for high-frequency designs, including E-band applications and high-speed signal integrity measurements.

M/A-COM Technology Solutions Inc. Showcases New Products at MTT-S 2012

June 12, 2012 11:16 am | News | Comments

What: M/A-COM Technology Solutions (M/A-COM Tech is showcasing a broad portfolio of new products for wireless backhaul, CATV, optical communications, and aerospace and defense applications at the IEEE/MTT-S International Microwave Symposium tradeshow in Montréal, Canada. New product solutions on display in M/A-COM Tech’s Booth #815 include: • 42 GHz SmartSet chipset for Point-to-Point wireless backhaul – includes state-of-the-art 1 Watt Power Amplifier with 22 dB gain and 38 dBm OIP3.

Teseq Holding AG to Acquire IFI, Increasing Its Presence in the RF Amplifier Market

June 12, 2012 10:28 am | News | Comments

Teseq Holding AG intends to acquire New York-based Instruments for Industry (IFI). By combining the competencies of IFI and the recently acquired MILMEGA with its own capabilities, Teseq will expand its capabilities and broaden its product line in the RF amplifier market, providing its customers with the best possible solutions in variety of applications including commercial, industrial automotive, military, defense and communications.

Agilent Technologies Accelerates Early Wireless Design Verification with New Release of SystemVue

June 12, 2012 10:21 am | News | Comments

Agilent Technologies Inc. today announced a new release of SystemVue , Agilent’s premier platform for designing communications systems. Agilent will demonstrate SystemVue 2012.06 along with a range of solutions for everything from circuit-level modeling through system verification for general RF, microwave, 4G communications, and aerospace/defense applications at DAC2012 (Booth 313), June 3-7, in San Francisco.

Agilent RF/Microwave Design and Test Products at IMS 2012

June 12, 2012 10:05 am | News | Comments

Agilent Technologies Inc. will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal. “We are really excited about our new tools for circuit-level modeling through system verification for general RF/uW, 4G communications, and aerospace/defense applications,” said Barry Alcorn, Americas market segment manager in Agilent’s Electronic Measurement Group.

Remembering Dr. Roger Pollard: A Life of Innovation, Collaboration and Leadership

June 12, 2012 5:39 am | by Henri | News | Comments

This is a belated tribute to Dr. Roger Pollard, an esteemed collaborator and colleague who passed away last December at the age of 65—much too soon. All in the industry are invited to attend a special session in Roger’s honor during IMS 2012 in Montreal: session TH3H-1, Thursday, June 21, 1:50 to 2:10 p.

Industry-Leading High-Performance RF Components at IEEE IMS 2012

June 11, 2012 12:09 pm | News | Comments

RF Micro Devices, Inc. announced today it will showcase its broad portfolio of products and technologies for the wireless and wired broadband markets at the upcoming IEEE International Microwave Symposium (IMS), held June 17-22, in booth #1210 at the Palais des Congres in Montreal, Canada. RFMD will exhibit innovative products serving a wide range of end-markets, including: GaN Power, point-to-point microwave radio, WiFi, wireless infrastructure, and smart energy AMI/ZigBee(R).

Freescale Introduces its First GaN RF Product for Cellular Infrastructure Applications

June 11, 2012 11:58 am | News | Comments

Freescale Semiconductor today revealed its first RF power amplifier product built using gallium nitride (GaN) technology. The company’s RF power GaN products will initially target the cellular infrastructure market, with potential future applications including avionics, radar, ISM and software-defined radio.

Richardson RFPD at IMS2012

June 11, 2012 11:50 am | News | Comments

Richardson RFPD, Inc. today announces its attendance and participation at the 2012 IEEE International Microwave Symposium (IMS). IMS, along with the RFIC symposium and the ARFTG conference, is part of Microwave Week, the largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest and most advanced research in these fields.

API Technologies to Showcase Products at IMS2012

June 11, 2012 11:22 am | News | Comments

API Technologies Corp. announced today that it will, for the first time ever, showcase its complete family of microwave, RF, and millimeter wave products at Booth #1306 during the IEEE International Microwave Symposium (IMS2012). IMS2012 takes place June 19-21 at the Palais des Congrès in Montreal. API's family of products include RF components, microwave filters, microelectronics, amplifiers and amplifier subsystems, and frequency sources from brands including Spectrum Microwave, CMT, National Hybrid, C-MAC Aerospace, and Cobham MAL.

Emerson & Cuming Microwave Products to Attend IMS 2012

June 11, 2012 7:06 am | News | Comments

Laird Technologies announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.

GoldenGate Software Release Accelerates Design Verification

June 4, 2012 12:14 pm | News | Comments

Agilent Technologies announced the latest release of its RFIC simulation, verification and analysis software, GoldenGate 2012. Raising the bar on performance and usability, the 2012 release offers RFIC designers a host of technology enhancements for accelerated design verification, extended design-for-manufacturing solutions and improved links to system design.

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