Molex Incorporated has launched a new application (app) that gives tablet users ready access to information on over 90 different Molex product families. Designed for Apple and Android devices, the Molex App allows tablet users to view product information, search products, view literature and view videos without being online.
IBM Watson At Your Service: New Watson Breakthrough Transforms How Brands Engage Today's Connected ConsumersMay 29, 2013 3:15 pm | by IBM | News | Comments
Ushering in a new era of cognitive computing systems, IBM has unveiled the IBM Watson Engagement Advisor, a technology breakthrough that allows brands to crunch big data in record time to transform the way they engage clients in key functions such as customer service, marketing and sales.
Tech Valley Communications (TVC), a facilities based telecommunications service provider operating networks in New York and Northern New England, has announced the appointment of Maura Mahoney as Senior Director of Marketing and Product Management effective immediately.
Telefónica Digital has been highlighted as a global leader in M2M Communication Service Provision (CSP) by two separate analyst houses. Analysys Mason, in their 2013 M2M Scorecard, placed Telefónica in the ‘Industry Icons’ category. While in their annual benchmarking study, Machina Research noted that ‘Telefónica is the company that has done most during the last 12 months to strengthen its position in M2M’.
Agilent Technologies Inc. [NYSE: A] has introduced the latest addition to its repeater model library for quickly and accurately solving the challenge posed by signal distortion in the multigigabit-per-second regime.
CoTap, a new company created by former Yammer Chief Product Officer Jim Patterson and Senior Director of Engineering Zack Parker, hasannounced that it has raised a $5.5 million Series A round of funding that will accelerate the development of its workplace mobile messaging product.
For decades, technology experts and home automation enthusiasts have been talking about and promising the emergence of the smart, connected home. They have foretold a home connected by multitude of sensors, monitoring applications such as HVAC, home security, and even the health of the inhabitants, and all controlled remotely over the web via a smartphone or a tablet.
RFMW has announced a web based tool that allows designers to create semi-custom Voltage Controlled Oscillators (VCOs) and Phase Locked Loop (PLL) synthesizers. Designers can search a large database of existing products based on parametric requirements and jump directly to existing product information.
SanDisk Corporation [NASDAQ: SNDK] has announced it has begun customer sampling of flash memory products based on its industry-leading 1Ynm process technology, which represents its second generation 19 nanometer (nm) manufacturing technology.
B&K Precision has announced its new MDL Series, a modular programmable DC electronic load system. The MDL Series comprises six unique modules ranging in power from 200 W to 600 W. Any combination of these modules can be installed for multi-channel operation in the 4-slot MDL Series mainframe...
Teseq has expanded its broadband amplifier line to include a Class A linear and low distortion model that operates from 10 kHz to 400 MHz with a rated power level of 260 watts. Used in commercial or in-house EMC test laboratories, the CBA 400M-260 is ideal for automotive, military and aerospace BCI applications that require testing at higher levels.
Hundreds of Leading Global Experts to Address Latest Advances in Voice, Data, Image & Multimedia Technologies at IEEE ICC 2013May 29, 2013 10:37 am | by IEEE | News | Comments
The 2013 IEEE International Conference on Communications (ICC), the leading international venue dedicated to the advancement of wireless and wireline communications, has expanded its comprehensive learning schedule with the addition of hundreds of senior telecommunications experts dedicated to the advance of the latest voice, data, image & multimedia technologies worldwide.
Interop Technologies, a provider of core wireless solutions for advanced messaging, over-the-air handset management, and connectivity gateways, today announced that Nex-Tech Wireless will deploy its cloud Rich Communication Services (RCS) solution. The regional operator has also renewed its multi-year agreements for Interop’s cloud-based Short Message Service (SMS), Multimedia Message Service (MMS)...
Wondering why you should attend the International Microwave Symposium (IMS) this year? Tom Raschko, 2013 IEEE MTT-S IMS General Chair, states why he is looking forward to the show this year, and intoriduces others who share their experiences from previous years.
Intellectual Ventures’ Global Head of Technology Dr. Patrick Ennis will serve as plenary session speaker on Monday, June 3 at the IEEE MTT-S 2013 International Microwave Symposium (IMS), kicking off a full schedule of 160 technical sessions and more than 550 exhibitors.
The IEEE MTT-S 2013 International Microwave Symposium (IMS) is set to debut Wireless Industry Day, which will be held on June 5 at the Washington State Convention Center as part of Microwave Week. Wireless Industry Day is designed to showcase both emerging technologies and provide practical, application-oriented information to attendees and the regional wireless community.
New revelations that China used cyberattacks to access data from nearly 40 Pentagon weapons programs and almost 30 other defense technologies have increased pressure on U.S. leaders to take more strident action against Beijing to stem the persistent breaches.
ALMA’s Department of Engineering Head and joint ALMA Observatory Project Manager, Michael Thorburn, and Dr. David Tennenhouse, Corporate Vice President of Technology Policy for Microsoft, will present closing ceremony keynotes on Thursday, June 6 at the 2013 IEEE MTT-S International Microwave Symposium (IMS) in Seattle.
Vishay Intertechnology to Showcase MLCCs and Surface-Mount and Wire-Bondable Thin Film Products at IMS 2013May 29, 2013 9:43 am | by Vishay Intertechnology, Inc. | News | Comments
Vishay Intertechnology, Inc. [NYSE: VSH] has announced that it will be showcasing the company's latest industry-leading multi-layer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products at the 2013 IEEE MTT International Microwave Symposium (IMS) ...
Agilent Technologies Inc. [NYSE: A] will demonstrate 25 of its newest design and measurement solutions at the IEEE MTT-S International Microwave Symposium (Booth #1230), June 2-7, at the Washington State Convention Center in Seattle.
When the IEEE International Microwave Symposium opens, Laird Technologies, Inc. will be there to showcase its best-in-class EMI and microwave materials to design engineers looking for solutions with proven results. Addressing EMI issues early in the design process is critical, and Laird’s customizable solutions are ideal for engineers working at VHF, UHF, microwave, and millimeter wave frequencies
Last week I wrote about how our continuous improvement and process improvement tools and methods can be used any time and discussed the Parameter Diagram or P-diagram as an example. Let’s continue that thread and look at the ubiquitous usefulness of the problem statement.
Cypress Semiconductor (San Jose, CA) announced that its TrueTouch Gen4 touchscreen controller family now delivers multiple new advanced features, including the world’s best tracking of gloved fingers on capacitive touchscreens.
Custom MMIC (Westford, MA) has added a new 6 – 11 GHz low noise amplifier to their growing line of high quality products. Ideal of microwave radios and C- and X-band applications where small size and low power consumption are needed, the CMD186P3 is also suitable for point-to-point radios and phased-array radar applications.
Infineon Technologies AG (Neubiberg, Germany) has introduced BGA825L6S, a highly cost-effective Low Noise Amplifier (LNA) for Global Navigation Satellite Systems (GNSS). It features an ultra-low noise figure, high linearity, high gain and low current consumption over a wide range of supply voltages from 3.6V down to 1.5V.