IC
System-Level Design and Verification of Wireless Embedded System to Meet Global Demands Using a Mixed Domain Oscilloscope
May 28, 2013 3:15 pm | by Faride Akretch, Technical Marketing Manager, Tektronix | Articles | CommentsDesigning and implementing wireless systems to be used in different geographic regions around the world represents a significant challenge. Wouldn’t it be nice if everyone all agreed on the use of frequency, modulation type, power levels, and bandwidth? Unfortunately, that’s not the world we live in and radio regulations vary from region to region, especially for some of the frequencies used in unlicensed radio...
LISTED UNDER: Electromechanical / Mechanical | Embedded Systems & Networking | IC
The U.S. Market & Design for Test
May 23, 2013 4:10 pm | by W. Scott Fillebrown, President & CEO of ACD | Blogs | CommentsBecause many high-volume printed circuit assemblies are sent outside the United States, it is challenging to test the lower volume/high turnover assemblies domestically. But this does not need to be a problem — some simple planning and the right contract manufacturer (CM) can solve this issue.
LISTED UNDER: IC | Interconnect, Cables | Interconnect, Connectors
WAGO's Pluggable Connector Systems Receive International Certification
May 23, 2013 8:31 am | by WDD Staff | Product Releases | CommentsWAGO Corporation's picoMAX and picoMAX eCOM Pluggable Connector Systems are certified UL 1059 and 1977, CB (Certification Body), and CSA. These international certifications confirm the all-new design's technical properties as connector and terminal block components.
LISTED UNDER: IC | Interconnect, Connectors
Intel Taps COO Krzanich as Chipmaker's Next CEO
May 3, 2013 9:17 am | by PETER SVENSSON, AP Technology Writer | News | CommentsIntel, one of the pillars of Silicon Valley, is following its traditions and promoting an insider to the job of CEO. The world's largest chipmaker is tasking Chief Operating Officer Brian Krzanich with steering it through an industry shake-up that is seeing tablets...
LISTED UNDER: IC
AVX’s New Open-Ended Card Edge Connectors
April 30, 2013 9:37 am | by WDD Staff | Product Releases | CommentsAVX Corporation has introduced a unique new open-ended card edge connector specifically designed to provide lighting engineers with a miniature, cost-effective, and high density pin-count solution for use in linear LED strip lighting.
LISTED UNDER: IC | Interconnect, Connectors
IAR Announces RX111 Microcontroller Support
April 29, 2013 10:23 am | by WDD Staff | Product Releases | CommentsIAR Systems has announced full support for the newly introduced RX111 microcontrollers. As a result of IAR Systems’ strategic alliance with Renesas, immediate support for the group is available in the world-leading C/C++ development tool suite IAR Embedded Workbench.
LISTED UNDER: IC | Power, Microcontrollers | Semiconductors, IC
PV Connector from Amphenol UL Certified to 1000 V
April 22, 2013 11:55 am | by WDD Staff | Product Releases | CommentsAmphenol Industrial Global Operations announced that its Helios H4 is UL certified to 1000 V. This UL rating allows Amphenol’s connectors to be used in existing systems as well as in new ones that require more voltage without having to increase cable size.
LISTED UNDER: IC | Components, Other | Interconnect, Connectors
Challenges with Microcell Deployment & Configuration
April 19, 2013 10:11 am | by Sinisa Peric, Chief R&D Engineer, QRC Technologies and Thomas Callahan, GM & CTO, QRC Technologies | Articles | CommentsWith cellular phones becoming not just voice, but now also data appliances, there is a growing need for operators to provide wide area (3-5 mile) coverage that assures high-rate data and voice services in nearly every location. What used to be considered “acceptable” gaps in coverage, like isolated homes...
LISTED UNDER: Antennas, Other | Computing | Electromechanical / MechanicalWireless "Smart Skin" Sensors Could Provide Remote Monitoring of Infrastructure
April 17, 2013 9:57 am | by John Toon, Georgia Institute of Technology | News | CommentsMajor bridge failures in recent years have focused attention on the need to monitor America’s highway bridges and other infrastructure. As thousands of bridges, parking garages and other structures age, improved methods for detecting deterioration could save lives and prevent economic disruption.
LISTED UNDER: Boards & Modules | Computing | Chipsets, RF
HAN GND – Now a Pluggable Ground Connector
April 4, 2013 11:02 am | by WDD Staff | Product Releases | CommentsHARTING’s Han GND (Han-Ground) new connector series makes it possible to create grounding systems with pluggable connections. The Han GND, is a single-pole, slim design connector that features a robust green and yellow plastic (polycarbonate) housing and module.
LISTED UNDER: IC | Components, Other | Interconnect, Connectors
Quantum Tricks Drive Magnetic Switching into the Fast Lane
April 4, 2013 10:22 am | by Ames Laboratory | News | CommentsResearchers at the U.S. Department of Energy’s Ames Laboratory, Iowa State University, and the University of Crete in Greece have found a new way to switch magnetism that is at least 1,000 times faster than currently used in magnetic memory technologies. Magnetic switching is used to encode information in hard drives ...
LISTED UNDER: Consumer | IC | Components, OtherA Low-Power 60 GHz Radio Frequency Chip
April 2, 2013 8:48 am | by The Korea Advanced Institute of Science and Technology | News | CommentsAs the capacity of handheld devices increases to accommodate a greater number of functions, these devices have more memory, larger display screens, and the ability to play higher definition video files. If the users of mobile devices, including smartphones, tablet PCs, and notebooks...
LISTED UNDER: Chipsets, IF | Chipsets, Multifunction | Chipsets, Other
Redpine Signals' Wireless M2M Combo Chip for the Internet of Things
March 21, 2013 10:49 am | by WDD Staff | Product Releases | CommentsRedpine Signals, Inc. has announced the release of its RS9113 M2MCombo chip, the first of its kind in the industry. It integrates dual-band 802.11n Wi-Fi, ZigBee, and dual-mode BT 4.0 wireless connectivity, making it the ideal device for universal M2M communications applications.
LISTED UNDER: Chipsets, IF | Chipsets, Multifunction | Chipsets, Other
WAGO's picoMAX eCOM Pinstrip Pluggable Terminal Blocks
March 20, 2013 11:03 am | by WDD Staff | Product Releases | CommentsWAGO Corporation’s picoMAX eCOM Pinstrip Pluggable Terminal Blocks support OEMs manufacturing automation, test/measurement and process electronics. New to the picoMAX PCB Connector family, the value-driven eCOM provides additional efficiency and usability by eliminating the pin housing.
LISTED UNDER: IC | Interconnect, Connectors
Stackpole's New HMC Series with High Resistance Values
March 19, 2013 10:56 am | by WDD Staff | Product Releases | CommentsThe HMC Series from Stackpole is a thick film based chip resistor series capable of high resistance values. This series utilizes special high resistance inks and volume production to achieve a chip resistor that is capable of extremely high resistance values without significant cost increase.
LISTED UNDER: Chipsets, Other | IC | Passives, Variable Resistors
