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Development Kits / Platforms

5% Tolerance Thick Film Chip Resistor Sample Kits

July 25, 2014 8:46 am | by WDD Staff | Product Releases | Comments

The RMCF Series thick film general-purpose chip resistors are now available in 5% tolerance design kits from Stackpole. The 5% kits have been added to supplement the popular 1% design kits...

LISTED UNDER: Development Kits | Development Kits / Platforms
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Microchip’s MOST ToGo Reference Designs

July 23, 2014 2:29 pm | by WDD Staff | Product Releases | Comments

Microchip Technology announced its MOST ToGo Reference Designs, which make it easy for designers to learn and implement the proven MOST technology in their automotive infotainment systems...

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Embedded Systems & Networking

Take Big Ideas to the Cloud with TI’s Tiva C Series Connected LaunchPad

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Texas Instruments has announced the latest addition to its popular microcontroller LaunchPad ecosystem – the Tiva C Series Connected LaunchPad. This Internet of Things (IoT), innovative platform...

LISTED UNDER: Development Kits / Platforms

RacoWireless, B&B Electronics Team Up to Offer Pre-Packaged Connectivity

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

B&B Electronics and RacoWireless have announced that they have teamed up to offer a Spectre cellular router with a prepaid wireless data plan. The B&B Electronics Spectre 3G cellular router, together with RacoWireless network services, provides everything customers need to connect, develop, deploy, and use M2M applications on the secure USA T-Mobile 3G cellular data network...

LISTED UNDER: Development Kits / Platforms

Agilent Selected by Nitronex for High-Power GaN Design

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Agilent Technologies has announced that Nitronex has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation. The flow uses Agilent EEsof EDA’s IC-CAP...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking | Semiconductors, Diodes

QuickLogic Announces KitKat Compliance of Ultra-low Power Sensor Hub

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

QuickLogic has announced the immediate availability of its new Always-on Context Aware Sensor Hub catalog CSSP, which gives OEMs an out-of-the-box solution for the Android 4.4 (KitKat) operating system...

LISTED UNDER: Development Kits / Platforms | Software, Development

Ettus Research Releases SDR Platforms Featuring Kintex-7 FPGA

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Ettus Research, a National Instruments company, has introduced the USRP X300 and USRP X310 high-performance, modular software defined radio (SDR) platforms. Developers can programmatically control the USRP with the UHD C++ API, or choose from third-party tools and software...

LISTED UNDER: Development Kits / Platforms | Software, Design | Software, Development

Loctronix's New ASR Workbench

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Loctronix has announced the availability of the ASR Workbench, a development toolset for the company’s recently released ASR-2300 software-defined radio (SDR) module.  The ASR-2300 is a function-rich SDR for high-performance positioning, navigation and timing (PNT), and communication applications...

LISTED UNDER: Development Kits / Platforms | Components, Other

TI Introduces SimpleLink Bluetooth Module

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Texas Instruments has announced the expansion of its SimpleLink Bluetooth CC256x portfolio with the addition of new modules and audio reference designs for rapid prototyping, development, and production...

LISTED UNDER: Development Kits / Platforms

ACCES I/O Products Releases RS-232 Serial Adapter for Android Devices

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

ACCES I/O Products has released a new USB serial interface board—the ANDROID-232. Users can now control legacy RS-232 devices directly from modern Android devices. The ANDROID-232 uses the Android Open Accessory protocol to convince an Android device that its onboard USB port is an RS-232 port...

LISTED UNDER: Development Kits / Platforms | Components, Other | Power, Other

Vishay Intertechnology’s New Thin Film Chip Resistor Laboratory Sample Kits

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Vishay Intertechnology has announced that the company is now offering laboratory sample kits of its high-stability thin film chip resistors. The TNPW0402 e3 (LTW0402 e3 96/4) and TNPW0603 e3 (LTW0603 e3 96/4) kits...

LISTED UNDER: Development Kits / Platforms | Chipsets, Other

Advantech 1U Server Extends Carrier Grade Product Line

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Advantech has rolled out a new addition to its carrier-grade, NEBS-compliant server line in a flexible and compact 1U package with a depth of just 20”. The CGS-3000 is optimized for the needs of network equipment...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

Eurotech's Low Power Embedded Module

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Eurotech has announced the next generation of modules in the Catalyst series of embedded computers. The Catalyst BT Computer on Module (CoM), based on the Intel Atom E3800 series...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

New Insights into LTE-Advanced Category 6 Chipsets, Devices

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Agilent Technologies has introduced the E7515A UXM wireless test set. The UXM provides a broad range of capabilities that enable testing of the newest wireless device designs, delivering LTE-Advanced category 6 now and handling increasingly complex test cases in the future...

LISTED UNDER: Development Kits / Platforms | Test and Measurement, Other

Econais Launches the EC19W01

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Econais has announced the EC19W01, world’s smallest, smartest and most integrated 802.11b/g/n Wi-Fi System In Package (SiP) module.  The EC19W01 offers low power drain and features fully integrated MCU, Wi-Fi, cloud...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

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