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Development Kits / Platforms

SuperSpeed Explorer Kit to Accelerate USB 3.0 Designs

September 10, 2014 10:57 am | by WDD Staff | Product Releases | Comments

Cypress Semiconductor introduced a low-cost, easy-to-use development platform that enables designers to add high-performance USB 3.0 throughput to virtually any system...

LISTED UNDER: Development Kits / Platforms

QuickLogic Delivers First Smartphone and Wearable Sensor Hub

September 4, 2014 11:32 am | by WDD Staff | Product Releases | Comments

QuickLogic Corporation introduced its new ArcticLink 3 S2 platform, the second CSSP solution in its Sensor Hub roadmap...

LISTED UNDER: Development Kits / Platforms | Sensors & Transducers

VPX Systems to Jump Start Application Development

August 25, 2014 11:20 am | by WDD Staff | Product Releases | Comments

Pentek announced the launch of the newest member of the SPARK development systems, the Model 8267. The Model 8267 is pre-configured 3U VPX system to speed application development for the expansive family of Pentek Flexor FMC, Cobalt Virtex-6 and Onyx Virtex-7 FPGA 3U VPX software...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking
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4 x 4 True MIMO Evolution on EXM Wireless Test Set

August 6, 2014 4:25 pm | by WDD Staff | Product Releases | Comments

Agilent Technologies announced that its EXM wireless test set now supports 4x4 True MIMO capability for WLAN design and validation. This capability further advances the gigabit era for WLAN evolution...

LISTED UNDER: Development Kits | Development Kits / Platforms | Test & Measurement

5% Tolerance Thick Film Chip Resistor Sample Kits

July 25, 2014 8:46 am | by WDD Staff | Product Releases | Comments

The RMCF Series thick film general-purpose chip resistors are now available in 5% tolerance design kits from Stackpole. The 5% kits have been added to supplement the popular 1% design kits...

LISTED UNDER: Development Kits | Development Kits / Platforms

Microchip’s MOST ToGo Reference Designs

July 23, 2014 2:29 pm | by WDD Staff | Product Releases | Comments

Microchip Technology announced its MOST ToGo Reference Designs, which make it easy for designers to learn and implement the proven MOST technology in their automotive infotainment systems...

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Embedded Systems & Networking

Telit Debuts Enhanced One Stop. One Shop. Featuring m2mAIR Cloud

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Telit Wireless Solutions has announced new services resulting from their recent acquisition of ILS Technology. m2mAIR Cloud services are powered by the world-leading ILS Technology deviceWISE Application Enablement Platform (AEP). The addition of platform and cloud services enables...

LISTED UNDER: Development Kits / Platforms

ARM Mbed Development Platform for Bluetooth Smart Applications

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Nordic Semiconductor and ARM have announced the launch of the nRF51822-mKIT, a platform for fast, easy, and flexible development of Bluetooth Smart applications...

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Sensors & Transducers
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TI Introduces SimpleLink Bluetooth Module

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Texas Instruments has announced the expansion of its SimpleLink Bluetooth CC256x portfolio with the addition of new modules and audio reference designs for rapid prototyping, development, and production...

LISTED UNDER: Development Kits / Platforms

ACCES I/O Products Releases RS-232 Serial Adapter for Android Devices

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

ACCES I/O Products has released a new USB serial interface board—the ANDROID-232. Users can now control legacy RS-232 devices directly from modern Android devices. The ANDROID-232 uses the Android Open Accessory protocol to convince an Android device that its onboard USB port is an RS-232 port...

LISTED UNDER: Development Kits / Platforms | Components, Other | Power, Other

Econais Launches the EC19W01

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Econais has announced the EC19W01, world’s smallest, smartest and most integrated 802.11b/g/n Wi-Fi System In Package (SiP) module.  The EC19W01 offers low power drain and features fully integrated MCU, Wi-Fi, cloud...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

Take Big Ideas to the Cloud with TI’s Tiva C Series Connected LaunchPad

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Texas Instruments has announced the latest addition to its popular microcontroller LaunchPad ecosystem – the Tiva C Series Connected LaunchPad. This Internet of Things (IoT), innovative platform...

LISTED UNDER: Development Kits / Platforms

Agilent Technologies Introduces Real-Time Processing Capabilities for its PCIe Digitizers

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Agilent Technologies has introduced its next-generation real-time peak detection as one of the additional functionalities for its PCIe high-speed digitizers, starting with the U5303A 12 bit digitizer...

LISTED UNDER: Development Kits / Platforms | Digital Hardware, Signal Processing

New Insights into LTE-Advanced Category 6 Chipsets, Devices

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Agilent Technologies has introduced the E7515A UXM wireless test set. The UXM provides a broad range of capabilities that enable testing of the newest wireless device designs, delivering LTE-Advanced category 6 now and handling increasingly complex test cases in the future...

LISTED UNDER: Development Kits / Platforms | Test and Measurement, Other

Vishay Intertechnology’s New Thin Film Chip Resistor Laboratory Sample Kits

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Vishay Intertechnology has announced that the company is now offering laboratory sample kits of its high-stability thin film chip resistors. The TNPW0402 e3 (LTW0402 e3 96/4) and TNPW0603 e3 (LTW0603 e3 96/4) kits...

LISTED UNDER: Development Kits / Platforms | Chipsets, Other

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