RF MEMS Switch: What You Need to Know
March 19, 2013 10:25 am | by OMRON | White PapersOMRON’s MEMS switch has a SPDT（Single Pole Double Throw） contact configuration. Two MEMS chips that have a SPST (Single Pole Single Throw） contact configuration are installed on the ceramic package using the flip chip bonding method as shown Figure 1.
LISTED UNDER: IC | Components, Other | Switches, IC
Binder Expands Connector Series
March 18, 2013 10:58 am | by WDD Staff | Product Releases | CommentsBinder-USA has expanded its Series 768 and 718 M8 product line with new 8-pin panel-mount receptacles. The receptacles provide an ideal solution for applications requiring high pin numbers in areas with limited space. The connectors are commonly used for sensors and actuators...
LISTED UNDER: IC | Components, Other | Interconnect, Connectors
Lantronix Launches xPico Wi-Fi Device Server
February 27, 2013 9:29 am | by WDD Staff | Product Releases | CommentsLantronix, Inc. [NASDAQ: LTRX] has announced the launch of its new xPico Wi-Fi module, a compact, embedded wireless device server designed for easy and fast serial-to-Wi-Fi connectivity. The xPico Wi-Fi device features afootprint of 24 x 16.5 mm.
LISTED UNDER: Components, Other | Digital Hardware, Other | Digital Hardware, Signal ProcessingIAR Systems Launches Technical Training offering IAR Academy
February 26, 2013 3:13 pm | by IAR Systems | News | CommentsIAR Systems has announced the launch of IAR Academy, an educational offering aimed at new as well as experienced users of IAR Embedded Workbench, the world-leading development tool suite for embedded applications.
LISTED UNDER: Computing | Consumer | Components, Other
Sierra Wireless Introduces AirPrime Wireless Modules
February 25, 2013 11:17 am | by WDD Staff | Product Releases | CommentsSierra Wireless [NASDAQ: SWIR] has introduced the industry’s most advanced architecture for embedded wireless communications, designed to vastly simplify and accelerate the development and deployment of M2M solutions. The architecture will be available across 2G to 4G technologies in the next generation of AirPrime embedded wireless modules.
LISTED UNDER: Circuits, Thin Film | Components, Other | Memory, DRAM
Increased Performance in RF/IF Signal Recorders
February 25, 2013 11:14 am | by WDD Staff | Product Releases | CommentsPentek, Inc. has announced rackmount additions to its Talon RF/IF signal recording and playback systems. The Model RTS 2707 rackmount system and Model RTR 2747 rugged rackmount system, offer recording and playback of RF/IF signals up to 700 MHz with signal bandwidths up to 200 MHz.
LISTED UNDER: Circuits, Mixed Signal | Components, Other | Digital Hardware, OtherGenerating Multiple Digitally Modulated Carriers Using an AWG
December 15, 2010 11:11 am | Articles | CommentsBy Thomas Dippon, Agilent Technologies When testing wideband RF components and systems, it is necessary to stimulate the device under test (DUT) with a wideband signal that is as close to the “real” signal as possible. For some measurements, wideband noise or a multi-tone signal might be appropriate.
SIGINT Systems Adapt for Rapidly Changing Threats
August 8, 2010 5:17 pm | Articles | CommentsBy Chris Desalvo, Agilent Technologies Commercially available RF transmitters in the ever-evolving wireless communications technology give SIGINT and COMINT mission managers a most difficult task. They need to detect traditional push-to-talk signals, wideband digital communications, and always be thinking of future threats.
Solutions for Nonlinear Characterization of High-Power Amplifiers
April 22, 2010 5:20 am | Articles | CommentsBy Keith Anderson, Agilent Technologies click to enlarge Figure 1. NVNA block diagram. High-power RF amplifiers are used in telecommunications, biomedical, and military systems. With output power levels ranging up to 1kW, these amplifiers are typically designed to operate near or into compression in order to provide the maximum output power possible.
Introduction to LTE Base Station RF Conformance Testing
December 14, 2009 11:47 am | Articles | CommentsBy Moray Rumney and Hiroshi Yanagawa, Agilent Technologies, Inc. Operator acceptance testing is yet another step in the process and includes more user-centric tests. click to enlarge Table 1. Base station RF transmitter characteristics tests.
Dual Channel MIMO Measurements for WiMAX™ Wave 2
June 26, 2009 12:31 pm | Articles | CommentsBy Benjamin Zarlingo, Agilent Technologies Inc. In designing, troubleshooting and optimizing WiMAX Wave 2 systems, a variety of dual-channel measurements can provide essential insight into their operation and performance. click to enlarge Table 1.
Agilent Technologies to Display Innovations in Design, Test Capabilities at IEEE MTT-S IMS 2009
June 18, 2009 8:16 am | News | CommentsAgilent Technologies Inc. demonstrated its newest innovations in design and measurement solutions for advanced RF and microwave research, development and manufacturing at the IEEE MTT-S International Microwave Symposium 2009 last week. Connecting experts to experts, the popular MicroApps Theater, sponsored by Agilent, will offer 19 MicroApps sessions.
Incorporating a Touch Interface into Wireless Designs
May 26, 2009 7:00 am | Articles | CommentsIncorporating touch into a wireless product design introduces additional complexity with radios, antennas and the attendant higher power consumption. By Bruce DeVisser, Fujitsu Components America, Inc. Figure 1. Identifying early-on where a wireless touch device is primarily being designed to perform will help to quickly bring together the right touch parameters.
Testing Challenges of SDR's
December 30, 2008 10:24 am | Articles | CommentsA new modeling methodology combines FPGAs and detailed circuit-level modeling in a design-to-test flow. By Greg Jue and David Leiss, Agilent Technologies click to enlarge Figure 1. This high-level design flow begins with the design of key algorithms which can be quickly evaluated in simulation to verify system performance with just a handful of simulation blocks.
Testing LTE
September 22, 2008 12:45 pm | Articles | CommentsTesting LTE Design simulation can be useful in addressing LTE design and verification challenges but requires consideration in selecting the appropriate model abstraction for the given phase of the design cycle. By Greg Jue, Agilent Technologies Emerging standards such as 3GPP Long Term Evolution (LTE) present a number of design and verification challenges for system engineers.
