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Circuits

RFX1010 Broadband Sub-GHz CMOS RFeIC

July 21, 2014 11:49 pm | by WDD Staff | Product Releases | Comments

RFaxis announced that it is ramping up production of the RFX1010, a highly-integrated broadband CMOS RF Front-end Integrated Circuit (RFeIC) to serve the ZigBee and Internet of Things (IoT) market segments that use the 600/700/800/900MHz...

LISTED UNDER: Circuits

Analog Devices RF ICs for Multi-Band Base Stations and Microwave Point-to-Point Radios

June 16, 2014 10:14 am | by WDD Staff | Product Releases | Comments

Analog Devices has introduced new highly integrated RF ICs that greatly simplify the design and reduce the development cost of multi-band base stations and point-to-point (PtP) radios...

LISTED UNDER: Circuits, Mixed Signal

Cypress Expands the PSoC 4 Architecture

April 29, 2014 4:47 pm | by WDD Staff | Product Releases | Comments

Cypress Semiconductor has introduced a new product family from its PSoC 4 architecture that offers a low-cost, entry-level 32-bit ARM-based system-on-chip for quick, simple upgrades of legacy 8-bit and 16-bit MCUs. The PSoC 4000 family delivers...                         

LISTED UNDER: Boards & Modules | Embedded Systems & Networking | Chipsets, Other
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Richardson RFPD Introduces Two New Devices from MACOM

January 20, 2014 4:34 pm | by WDD Staff | Product Releases | Comments

Richardson RFPD announced immediate availability and full design support capabilities for two devices for 802.11ac applications from M/A-COM Technology Solutions (MACOM). The MAMF-010614 is a multi-function MMIC that includes a single-pole, double-throw (SPDT) switch and low noise amplifier (LNA) with bypass mode for the receive (Rx) path.

LISTED UNDER: Low-noise | Circuits, Mixed Signal | Components, Other

Fujitsu’s Ultra-Compact Bluetooth Low Energy Modules use Nordic Semiconductor’s Ultra-Low Power SoC

January 13, 2014 2:28 pm | by WDD Staff | Product Releases | Comments

With increasing OEM development of compact and low-cost Bluetooth low energy (BLE) devices and accessories, Fujitsu Components has introduced a new family of ultra-compact, BLE modules based on the Nordic Semiconductor nRF51822 SoC...

LISTED UNDER: Boards & Modules | Circuits, SOC

Hittite’s New 24 dB Power Detector

January 7, 2014 4:55 pm | by WDD Staff | Product Releases | Comments

Hittite Microwave has announced a new E-Band MMIC power detector that is ideal for communications systems, test equipment, sensors and general purpose RF detection over the 71 to 86 GHz frequency range...

LISTED UNDER: IC | Circuits, SOC | Components, Other

New Ultra-Precision Thin Film MELF Resistor

December 31, 2013 2:02 pm | by WDD Staff | Product Releases | Comments

Vishay Intertechnology has introduced a new series of high-precision thin film MELF resistors. Designed for demanding applications with high stability and reliability requirements...                 

LISTED UNDER: Circuits, Thin Film | Components, Other

Cypress's New PSoC Creator Simplifies Concurrent Hardware And Software Design

October 16, 2013 3:51 pm | by WDD Staff | Product Releases | Comments

Cypress Semiconductor has introduced version 3.0 of its PSoC Creator Integrated Design Environment (IDE) for the PSoC 3, PSoC 4, and PSoC 5LP programmable system-on-chip architectures.

LISTED UNDER: Boards & Modules | Circuits, SOC | Digital Hardware, DSPs
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Nordic Semiconductor's Concurrent ANT+ and Bluetooth Low Energy Combo Chip

October 9, 2013 12:55 pm | by WDD Staff | Product Releases | Comments

The nRF51922 System-on-Chip will allow the development of products that natively support ANT+ and Bluetooth low energy wireless technology and mean product developers; end users will no longer be forced to choose between these two previously incompatible wireless technologies.

LISTED UNDER: Circuits, SOC | Components, Other

Lansdale Sole Source for Motorola SPS

September 16, 2013 3:00 pm | by WDD Staff | Product Releases | Comments

Lansdale Semiconductor has announced the continued availability of the ML3371 and ML3372 Low Power Narrowband FM IF (Frequency Modulation) (Intermediate Frequency) circuits originally designed and built by Motorola Semiconductor.

LISTED UNDER: Circuits, Mixed Signal

Cypress Releases New Components for PSoC Creator 2.2 IDE

July 15, 2013 3:16 pm | by WDD Staff | Product Releases | Comments

Cypress Semiconductor has released new components for PSoC Creator 2.2, the integrated design environment (IDE) for Cypress’s PSoC 3, PSoC 4 and PSoC 5LP programmable system-on-chip architectures. The Component Pack 6 update includes four new PSoC Components—pre-verified “virtual chips.”

LISTED UNDER: Chipsets, Other | Circuits, SOC

Cypress’ PSoC 4 Architecture

March 29, 2013 9:50 am | by WDD Staff | Product Releases | Comments

Cypress Semiconductor Corp. [NASDAQ: CY] has unveiled the PSoC 4 programmable system-on-chip architecture, which combines Cypress’s best-in-class PSoC analog and digital fabric and industry-leading CapSense capacitive touch technology with ARM’s power-efficient Cortex-M0 core.

LISTED UNDER: Circuits, SOC | Components, Other | Receivers, Other

SFF Signal Processing Platform Expands VPX Ecosystem

March 25, 2013 12:48 pm | by WDD Staff | Product Releases | Comments

Elma Electronic Inc. (Fremont, CA), in cooperation with Pentek, Inc. (Upper Saddle River, NJ) and Concurrent Technologies (Woburn,MA), has developed a small form factor (SFF), OpenVPX-based signal acquisition system for processing and recording applications.

LISTED UNDER: Circuits, Mixed Signal | Components, Other

Ironwood Electronics' New High-Performance QFP Socket

March 1, 2013 8:46 am | by WDD Staff | Product Releases | Comments

Ironwood Electronics has introduced a new high-performance QFP socket for 0.4 mm pitch 128 pin QFP. The SG-QFE-7011 socket features a14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip and bandwidths up to 10 GHz with less than 1dB of insertion loss.

LISTED UNDER: Circuits, Comparators | Circuits, Mil-Spec | Circuits, Mixed Signal

Sierra Wireless Introduces AirPrime Wireless Modules

February 25, 2013 11:17 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Sierra Wireless [NASDAQ: SWIR] has introduced the industry’s most advanced architecture for embedded wireless communications, designed to vastly simplify and accelerate the development and deployment of M2M solutions. The architecture will be available across 2G to 4G technologies in the next generation of AirPrime embedded wireless modules.

LISTED UNDER: Circuits, Thin Film | Components, Other | Memory, DRAM

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