Circuits, Thin Film
KAIST's Vivo Flexible Large Scale Integrated Circuits
May 7, 2013 9:23 am | by The Korea Advanced Institute of Science and Technology (KAIST) | News | CommentsA team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.
LISTED UNDER: Circuits, Space | Circuits, Thick Film | Circuits, Thin Film
Creating Indestructible Self-Healing Circuits
March 12, 2013 9:23 am | by California Institute of Technology | News | CommentsImagine that the chips in your smart phone or computer could repair and defend themselves on the fly, recovering in microseconds from problems ranging from less-than-ideal battery power to total transistor failure. It might sound like the stuff of science fiction...
LISTED UNDER: Consumer | IC | Circuits, Comparators
Ironwood Electronics' New High-Performance QFP Socket
March 1, 2013 8:46 am | by WDD Staff | Product Releases | CommentsIronwood Electronics has introduced a new high-performance QFP socket for 0.4 mm pitch 128 pin QFP. The SG-QFE-7011 socket features a14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip and bandwidths up to 10 GHz with less than 1dB of insertion loss.
LISTED UNDER: Circuits, Comparators | Circuits, Mil-Spec | Circuits, Mixed Signal
Sierra Wireless Introduces AirPrime Wireless Modules
February 25, 2013 11:17 am | by WDD Staff | Product Releases | CommentsSierra Wireless [NASDAQ: SWIR] has introduced the industry’s most advanced architecture for embedded wireless communications, designed to vastly simplify and accelerate the development and deployment of M2M solutions. The architecture will be available across 2G to 4G technologies in the next generation of AirPrime embedded wireless modules.
LISTED UNDER: Circuits, Thin Film | Components, Other | Memory, DRAM
