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Vishay Intertechnology Enhances Series of Thin Film Chip Resistor Arrays

September 18, 2013 12:21 pm | by WDD Staff | Product Releases | Comments

Vishay Intertechnology has enhanced its ACAS 0612 precision thin film chip resistor arrays with tighter absolute TCR down to ± 10 ppm/K, relative TCR down to ± 5 ppm/K, and relative tolerance down to ± 0.05% for automotive, industrial, and telecommunications applications.

LISTED UNDER: Chipsets, Other | Passives, Fixed Resistors | Passives, Variable Resistors

Cypress Releases New Components for PSoC Creator 2.2 IDE

July 15, 2013 3:16 pm | by WDD Staff | Product Releases | Comments

Cypress Semiconductor has released new components for PSoC Creator 2.2, the integrated design environment (IDE) for Cypress’s PSoC 3, PSoC 4 and PSoC 5LP programmable system-on-chip architectures. The Component Pack 6 update includes four new PSoC Components—pre-verified “virtual chips.”

LISTED UNDER: Chipsets, Other | Circuits, SOC

CML Release New RF Building Block

May 9, 2013 9:03 am | by WDD Staff | Product Releases | Comments

The CMX972 Quadrature Modulator/Demodulator is the latest RF building block from CML Microcircuits, following on from the popular CMX970, CMX971, and CMX973 devices. The new device features a low-power IF/RF Quadrature Demodulator with PLL/VCO; and a wide operating frequency range.

LISTED UNDER: Development Kits / Platforms | Chipsets, RF | Transceivers, RF / Microwave
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One-Chip Packaged RF Transceiver Chipsets

April 23, 2013 4:13 pm | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Infineon has in development a complete family of packaged RF Transceiver for Mobile Backhaul – beside BGT70 and BGT80 for E-band radio, also BGT60 for V-band radio. The Family approach has the major benefit due to it´s a modular approach...

LISTED UNDER: Transceivers, AM / FM | Transceivers, Cellular | Transceivers, GPS / GSM / PCS

Fast Standby Recovery with Ultra-Low Standby Power

April 12, 2013 11:09 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

iWatt Inc. has expanded its PrimAccurate pulse width modulation (PWM) controller platform to include two new power adapter chipsets that offer the company’s fastest standby recovery. The iW1766 + iW628 and iW1767 + iW628 chipsets provide...

LISTED UNDER: Chipsets, IF | Chipsets, Multifunction | Chipsets, Other

Redpine Signals' Wireless M2M Combo Chip for the Internet of Things

March 21, 2013 10:49 am | by WDD Staff | Product Releases | Comments

Redpine Signals, Inc. has announced the release of its RS9113 M2MCombo chip, the first of its kind in the industry. It integrates dual-band 802.11n Wi-Fi, ZigBee, and dual-mode BT 4.0 wireless connectivity, making it the ideal device for universal M2M communications applications.

LISTED UNDER: Chipsets, IF | Chipsets, Multifunction | Chipsets, Other

Stackpole's New HMC Series with High Resistance Values

March 19, 2013 10:56 am | by WDD Staff | Product Releases | Comments

The HMC Series from Stackpole is a thick film based chip resistor series capable of high resistance values. This series utilizes special high resistance inks and volume production to achieve a chip resistor that is capable of extremely high resistance values without significant cost increase.

LISTED UNDER: Chipsets, Other | IC | Passives, Variable Resistors

Imec & Panasonic Unveil Low-Power Chipset for 60GHz Multi-Gbit Wireless Communication

February 26, 2013 10:03 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Imec, in collaboration with Panasonic Corporation, has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60 GHz radio transceiver chipset with low power consumption that delivers high data rates over short distances.

LISTED UNDER: Chipsets, Other | Chipsets, RF | Transceivers, Other
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Components Corporation Reintroduces FJ Series

February 21, 2013 8:38 am | by WDD Staff | Product Releases | Comments

Components Corporation has reintroduced the FJ Series of printed circuit board Jumpers developed specifically for SMT applications in additional package sizes. The FJ-Series is a surface mount technology jumper, developed s for SMT applications.

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Chipsets, Other

Redpine Signals IntroducesWireless M2M Combo Chip

February 13, 2013 5:09 pm | by WDD Staff | Product Releases | Comments

Redpine Signals, Inc. has announced the release of its RS9113 M2MCombo chip, the first of its kind in the industry. It integrates dual-band 802.11n Wi-Fi, ZigBee, and dual-mode BT 4.0 wireless connectivity, making it the ideal device for universal M2M communications applications.

LISTED UNDER: Chipsets, Multifunction | Chipsets, Other | Digital Hardware, Other

Cost-effective UE910 V2 and Mid-range HE910 V2 Modules

January 8, 2013 4:34 am | Wireless Design & Development | Product Releases | Comments

Telit Wireless Solutions announced the introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3....

LISTED UNDER: Chipsets, Other | Software, Other

Enclosure Achieves 115 CFM of Airflow

November 26, 2012 5:18 am | Wireless Design & Development | Product Releases | Comments

Pixus Technologies has announced a new version of its SlimBox line of enclosures to address advanced cooling requirements. As new high speed (and high heat) chipsets are designed onto the latest CompactPCI, OpenVPX, and other boards; the requirement for additional enclosure cooling continues to grow.

LISTED UNDER: Chipsets, Other

Complete Suite of Wireless Technology for System-on-Chip (SoC) Integration

November 1, 2012 7:10 am | Wireless Design & Development | Product Releases | Comments

Redpine Signals, Inc. announced its full suite of wireless technologies (Wi-Fi®, Bluetooth®, ZigBee® ) is now available for SoC integration. The portfolio includes 802.11abgn 1x1 through 802.11abgn/ac 3x3; BT 4.0 ad ZigBee, which will all be demonstrated at booth-10 at the ARM TechCon at the Santa Clara Convention Center on October 30.

LISTED UNDER: Semiconductors, SoC | Chipsets, Other

Wireless Device Precompliance Testing goes into the Lab with Automated Tests

June 12, 2012 11:10 am | Wireless Design & Development | Product Releases | Comments

In wireless device precompliance testing, the compact R&S DST200 RF diagnostic chamber from Rohde & Schwarz now automatically sets the equipment under test (EUT) to the required position. The new options make the R&S DST200 the only RF test chamber on the market that enables OTA performance and RSE testing of wireless devices such as smartphones right on the lab bench.

LISTED UNDER: Services, Calibration / Test | Chipsets, Other

Aeroflex and 7Layers Collaborate on LTE Device Verification

February 23, 2012 4:25 am | Wireless Design & Development | Product Releases | Comments

Aeroflex and 7Layers, an international group of engineering & test centers, have joined forces to provide the LTE testing market with a cost-effective test system that assesses the interworking of LTE-capable terminals or chipsets with LTE networks and the Universal Integrated Circuit Card (UICC).

LISTED UNDER: Chipsets, Other

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