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Stackpole's New HMC Series with High Resistance Values

March 19, 2013 10:56 am | by WDD Staff | Product Releases | Comments

The HMC Series from Stackpole is a thick film based chip resistor series capable of high resistance values. This series utilizes special high resistance inks and volume production to achieve a chip resistor that is capable of extremely high resistance values without significant cost increase.

LISTED UNDER: Chipsets, Other | IC | Passives, Variable Resistors

Imec & Panasonic Unveil Low-Power Chipset for 60GHz Multi-Gbit Wireless Communication

February 26, 2013 10:03 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Imec, in collaboration with Panasonic Corporation, has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60 GHz radio transceiver chipset with low power consumption that delivers high data rates over short distances.

LISTED UNDER: Chipsets, Other | Chipsets, RF | Transceivers, Other

Components Corporation Reintroduces FJ Series

February 21, 2013 8:38 am | by WDD Staff | Product Releases | Comments

Components Corporation has reintroduced the FJ Series of printed circuit board Jumpers developed specifically for SMT applications in additional package sizes. The FJ-Series is a surface mount technology jumper, developed s for SMT applications.

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Chipsets, Other
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Redpine Signals IntroducesWireless M2M Combo Chip

February 13, 2013 5:09 pm | by WDD Staff | Product Releases | Comments

Redpine Signals, Inc. has announced the release of its RS9113 M2MCombo chip, the first of its kind in the industry. It integrates dual-band 802.11n Wi-Fi, ZigBee, and dual-mode BT 4.0 wireless connectivity, making it the ideal device for universal M2M communications applications.

LISTED UNDER: Chipsets, Multifunction | Chipsets, Other | Digital Hardware, Other

Cost-effective UE910 V2 and Mid-range HE910 V2 Modules

January 8, 2013 4:34 am | Wireless Design & Development | Product Releases | Comments

Telit Wireless Solutions announced the introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3....

LISTED UNDER: Chipsets, Other | Software, Other

Enclosure Achieves 115 CFM of Airflow

November 26, 2012 5:18 am | Wireless Design & Development | Product Releases | Comments

Pixus Technologies has announced a new version of its SlimBox line of enclosures to address advanced cooling requirements. As new high speed (and high heat) chipsets are designed onto the latest CompactPCI, OpenVPX, and other boards; the requirement for additional enclosure cooling continues to grow.

LISTED UNDER: Chipsets, Other

Complete Suite of Wireless Technology for System-on-Chip (SoC) Integration

November 1, 2012 7:10 am | Wireless Design & Development | Product Releases | Comments

Redpine Signals, Inc. announced its full suite of wireless technologies (Wi-Fi®, Bluetooth®, ZigBee® ) is now available for SoC integration. The portfolio includes 802.11abgn 1x1 through 802.11abgn/ac 3x3; BT 4.0 ad ZigBee, which will all be demonstrated at booth-10 at the ARM TechCon at the Santa Clara Convention Center on October 30.

LISTED UNDER: Semiconductors, SoC | Chipsets, Other

Wireless Device Precompliance Testing goes into the Lab with Automated Tests

June 12, 2012 11:10 am | Wireless Design & Development | Product Releases | Comments

In wireless device precompliance testing, the compact R&S DST200 RF diagnostic chamber from Rohde & Schwarz now automatically sets the equipment under test (EUT) to the required position. The new options make the R&S DST200 the only RF test chamber on the market that enables OTA performance and RSE testing of wireless devices such as smartphones right on the lab bench.

LISTED UNDER: Services, Calibration / Test | Chipsets, Other
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Aeroflex and 7Layers Collaborate on LTE Device Verification

February 23, 2012 4:25 am | Wireless Design & Development | Product Releases | Comments

Aeroflex and 7Layers, an international group of engineering & test centers, have joined forces to provide the LTE testing market with a cost-effective test system that assesses the interworking of LTE-capable terminals or chipsets with LTE networks and the Universal Integrated Circuit Card (UICC).

LISTED UNDER: Chipsets, Other

Discrete SOI Switches for Wireless Networking

January 3, 2012 11:06 am | Wireless Design & Development | Product Releases | Comments

Skyworks Solutions has introduced its first set of discrete silicon-on-insulator, single-pole, triple-throw switches for the wireless networking market. The SKY13345-368LF and SKY13385-460LF’s low insertion loss make the devices ideal for WLAN (802.11 b/g) and Bluetooth® applications in the 2.4 to 2.

LISTED UNDER: Embedded Systems & Networking | Switches, IC | Chipsets, Other

LTE Deployment and Timing Considerations

November 14, 2011 9:32 am | Wireless Design & Development | Product Releases | Comments

When considering the deployment and timing considerations for LTE and LTE Advanced and their inter-relation with existing 3G wireless technologies like HSPA & EV-DO, a well thought out migration strategy needs to be in place for deployment including spectrum considerations, plans to address capacity constraints/demands, implications with respect to handling new services including Voice/VoIP, QoE (Quality of Experience) issues as well as key business impacts.

LISTED UNDER: Chipsets, Other

Fujitsu Adds WiFi+Bluetooth Combo to Wireless Module Offering

November 4, 2011 10:40 am | Wireless Design & Development | Product Releases | Comments

Fujitsu Components America announced it has added a compact, 802.11b/g wireless LAN + Bluetooth version 2.1+EDR (Enhanced Data Rate) combination module. The fully integrated module minimizes piece parts while providing engineers with a cost-effective way to easily and quickly add both wireless technologies to new product designs without requiring special expertise.

LISTED UNDER: Chipsets, Other

The Tinker's Toolbox - Venkat Mattela of Redpine and Øyvind Strøm of Atmel on Wireless Embedded Systems

October 26, 2011 12:23 pm | Wireless Design & Development | Product Releases | Comments

Hosted by Alix Paultre, the Tinker's Toolbox is the Advantage Design Group's web-based interview show where we talk about the latest technology, components, and design issues for the electronic design engineering community.    Venkat Mattela Øyvind Strøm In today's podcast we talk to Venkat Mattela, CEO at Redpine Signals, and Øyvind Strøm, senior director of wireless marketing at Atmel abo...

LISTED UNDER: Embedded Systems & Networking | Chipsets, Other

D2 Technologies Partners with Altair Semiconductor to Create Ultra-Low Power 4G VoLTE Communications Solution

October 24, 2011 12:14 pm | Wireless Design & Development | Product Releases | Comments

D2 Technologies announced that it has partnered with one of the world's leading suppliers of commercial semiconductor solutions for FDD/TDD LTE, Altair Semiconductor, to meet the demand for turnkey LTE solutions. D2’s mCUE, a converged 4G mobile communications client for Voice over LTE (VoLTE) and RCS video calling applications, has been successfully integrated with Altair’s FourGee-3100/6200 LTE chipset platform.

LISTED UNDER: Chipsets, Other

CompactPCI Serial Board Provides Flexible Configuration

October 17, 2011 11:25 am | Wireless Design & Development | Product Releases | Comments

MEN Micro now offers the G215, a universal CompactPCI Serial peripheral board that provides flexible serial communication via an individual mix of UART and fieldbus interfaces. Although equipped with five standard interfaces, the G215 features a configurable FPGA IP core that offers nearly unlimited interface options that enables several functionalities.

LISTED UNDER: Chipsets, Other

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