Advertisement

Low-cost, Improved Performance and Quality of Metallized Ceramic Substrates

April 23, 2012 10:29 am | by Posted Janine E. Mooney, Editor | Wireless Design & Development | Product Releases | Comments

Remtec has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods.  The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.

LISTED UNDER: Ceramics

Enabling Technology for Tomorrow’s Ultrasound Imaging

July 12, 2011 7:15 am | Wireless Design & Development | Product Releases | Comments

By Chester Kaufman, STMicroelectronics Development Engineer - Medical In recent years, the landscape of ultrasound imaging technology has changed dramatically due to advancements in semiconductor and transducer technology. For instance, hand-carried ultrasound products have gone from niche products to main stream, and are today the fastest growing segment in ultrasound....

LISTED UNDER: Ceramics | Crystals

Enabling Technology for Tomorrow’s Ultrasound Imaging

July 12, 2011 7:15 am | Wireless Design & Development | Product Releases | Comments

By Chester Kaufman, STMicroelectronics Development Engineer - Medical In recent years, the landscape of ultrasound imaging technology has changed dramatically due to advancements in semiconductor and transducer technology. For instance, hand-carried ultrasound products have gone from niche products to main stream, and are today the fastest growing segment in ultrasound.

LISTED UNDER: Ceramics | Crystals
Advertisement

Spectrum's New Extruded Ceramic Tubular Capacitors Enhance Design Flexibility

June 27, 2011 8:49 am | Wireless Design & Development | Product Releases | Comments

Spectrum Advanced Specialty Products has added an extrusion process to their current manufacturing methods of ceramic tubular capacitors. The addition of this process enhances Spectrum's design flexibility with an increased custom product offering. Spectrum is now capable of producing sizes of up to 1" in length as well as diameters of ½" and larger.

LISTED UNDER: Passives, Capacitors | Ceramics

Richardson RFPD Selected as Sole Distributor for ATC Ultra-Broadband 506WLC Series Inductors

June 15, 2011 6:06 am | Wireless Design & Development | Product Releases | Comments

Richardson RFPD announced it has been selected by American Technical Ceramics (ATC) as the global exclusive distributor for the new 506WLC Series of Ultra-Broadband Inductors. This select group of inductors has been engineered with a powdered iron ferrite core and gold plated terminations to provide reliable and repeatable ultra-broadband performance beyond 40 GHz.

LISTED UNDER: Passives, Inductors | Ceramics

High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

January 19, 2011 6:45 am | Wireless Design & Development | Product Releases | Comments

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics....

LISTED UNDER: Ceramics

UTAF Piezo Motor Being Commercialized in Next-Gen Smart Phone Cameras

November 19, 2010 9:46 am | Wireless Design & Development | Product Releases | Comments

New Scale Technologies, Inc. has received its fifth U.S. patent for miniature piezoelectric motor technology. Trade-named the UTAF motor (for Ultra-Thin Auto Focus, its target application), the tiny new device integrates all ultrasonic motor functions into a single piezoelectric ceramic beam measuring only 4....

LISTED UNDER: Ceramics

Technologically Advanced RF, Microwave, and mmW Surface-Mount Capacitor

August 20, 2010 7:58 am | Wireless Design & Development | Product Releases | Comments

Available from Richardson Electronics, the 550L Series UBCTM (Ultra-Broadband) Capacitor from American Technical Ceramics (ATC) provides reliable and repeatable Ultra-Broadband performance from 16 kHz to over 40 GHz. Desired features include: •Defense/Aerospace Extended Operating Temp. Range (-55ºC to +125ºC) •One-piece, Orientation-Insensitive Package (Rugged Ceramic Construction) •Ultra-low Insertion Loss ( •Flat Frequency Resp...

LISTED UNDER: Ceramics
Advertisement

Capacitors Allow Designers to Reduce their Component Count and Shrink Board Space

August 6, 2010 9:26 am | Wireless Design & Development | Product Releases | Comments

AVX Corporation has expanded on its widely popular switch mode power supply (SMPS) capacitors series, TurboCap™. These capacitors allow designers to reduce their component count, shrink board space and maintain the benefits of ceramics such as low ESR/ESL, ability to withstand transients and the ability to handle large amounts of power in an efficient and compact package....

LISTED UNDER: Ceramics

Thermally Conductive Adhesives Dissipate Heat

March 6, 2009 6:56 am | Wireless Design & Development | Product Releases | Comments

Duralco 132 thermally conductive adhesives from Cotronics Corporation combine high temperature resins with highly conductive fillers to form thermally conductive, adhesive bonds with continuous service up to 500°F. They are suitable for any industrial, electrical or electronic high-power applications, including bonding and assembling heating coils, cooling coils, heating elements, heat sinks, reaction vessels, semi-conductors, rectifie...

LISTED UNDER: Ceramics

Packaging Performs in X through K Band Frequencies

September 23, 2008 11:55 am | Wireless Design & Development | Product Releases | Comments

AdTech Ceramics' Alumina High Temperature Cofired Ceramic (HTCC) and Aluminium Nitride (AIN) microwave packaging is appropriate for applications in the X through K band frequency range. The components are designed using 3D Finite Element Method (FEM) simulators and proprietary numerical simulators....

LISTED UNDER: Ceramics

Epoxy Adhesive Cures Rapidly at Room Temperature

September 22, 2008 12:45 pm | Wireless Design & Development | Product Releases | Comments

Master Bond, Inc. introduces its EP41SMED high performance, low viscosity epoxy adhesive for fast room temperature curing and bonding applications. This compound has a 5:1 mix ratio by weight, and it has “handling” time from 10 to 15 minutes at ambient temperatures. Bonds are resistant to water, oil and many organic solvents, as well as cold sterilants, ETO and gamma radiation....

LISTED UNDER: Ceramics

Sealing Electrical Connectors: When is it Worth Moving Up to Ceramic?

November 21, 2007 5:42 am | Wireless Design & Development | Product Releases | Comments

Ceramic-to-metal seals have a number of properties that allow for a more robust, durable hermetic seal and better electrical insulation than glass-to-metal seals. Morgan Advanced Ceramics (MAC) Range of Options When engineers design a seal for feedthroughs and other electrical connectors, four general classes of material are evaluated....

LISTED UNDER: Interconnect, Connectors | Ceramics

Alumina Ceramic Components

November 8, 2007 7:41 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers miniature, dry-pressed alumina ceramic components from its GBC Materials Division. Manufactured in outer dimensions ranging from 0.020” to 2”, the ceramic materials provide a cost-effective solution for demanding applications. Designed for miniature electronic devices, these small pressed alumina components are suitable for use in telecommunications, appliance and electronic applications....

LISTED UNDER: Ceramics

Compact Multilayer Capacitors for RF Applications

September 26, 2007 8:17 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics (MEC) launches its 10 mm square, type 106 RF multi-layer ceramic capacitor that offers high capacitance and performance in a small unit volume, providing operation for a variety of high RF voltage and high RF current applications. These capacitors are made from a low loss modified magnesium titanate ceramic and internal electrodes which, when sintered under controlled conditions, form a monolithic and hermetically se...

LISTED UNDER: Ceramics

Pages

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading