High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

January 19, 2011 6:45 am | Wireless Design & Development | Product Releases | Comments

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics....


UTAF Piezo Motor Being Commercialized in Next-Gen Smart Phone Cameras

November 19, 2010 9:46 am | Wireless Design & Development | Product Releases | Comments

New Scale Technologies, Inc. has received its fifth U.S. patent for miniature piezoelectric motor technology. Trade-named the UTAF motor (for Ultra-Thin Auto Focus, its target application), the tiny new device integrates all ultrasonic motor functions into a single piezoelectric ceramic beam measuring only 4....


Technologically Advanced RF, Microwave, and mmW Surface-Mount Capacitor

August 20, 2010 7:58 am | Wireless Design & Development | Product Releases | Comments

Available from Richardson Electronics, the 550L Series UBCTM (Ultra-Broadband) Capacitor from American Technical Ceramics (ATC) provides reliable and repeatable Ultra-Broadband performance from 16 kHz to over 40 GHz. Desired features include: •Defense/Aerospace Extended Operating Temp. Range (-55ºC to +125ºC) •One-piece, Orientation-Insensitive Package (Rugged Ceramic Construction) •Ultra-low Insertion Loss ( •Flat Frequency Resp...


Capacitors Allow Designers to Reduce their Component Count and Shrink Board Space

August 6, 2010 9:26 am | Wireless Design & Development | Product Releases | Comments

AVX Corporation has expanded on its widely popular switch mode power supply (SMPS) capacitors series, TurboCap™. These capacitors allow designers to reduce their component count, shrink board space and maintain the benefits of ceramics such as low ESR/ESL, ability to withstand transients and the ability to handle large amounts of power in an efficient and compact package....


Thermally Conductive Adhesives Dissipate Heat

March 6, 2009 6:56 am | Wireless Design & Development | Product Releases | Comments

Duralco 132 thermally conductive adhesives from Cotronics Corporation combine high temperature resins with highly conductive fillers to form thermally conductive, adhesive bonds with continuous service up to 500°F. They are suitable for any industrial, electrical or electronic high-power applications, including bonding and assembling heating coils, cooling coils, heating elements, heat sinks, reaction vessels, semi-conductors, rectifie...


Packaging Performs in X through K Band Frequencies

September 23, 2008 11:55 am | Wireless Design & Development | Product Releases | Comments

AdTech Ceramics' Alumina High Temperature Cofired Ceramic (HTCC) and Aluminium Nitride (AIN) microwave packaging is appropriate for applications in the X through K band frequency range. The components are designed using 3D Finite Element Method (FEM) simulators and proprietary numerical simulators....


Epoxy Adhesive Cures Rapidly at Room Temperature

September 22, 2008 12:45 pm | Wireless Design & Development | Product Releases | Comments

Master Bond, Inc. introduces its EP41SMED high performance, low viscosity epoxy adhesive for fast room temperature curing and bonding applications. This compound has a 5:1 mix ratio by weight, and it has “handling” time from 10 to 15 minutes at ambient temperatures. Bonds are resistant to water, oil and many organic solvents, as well as cold sterilants, ETO and gamma radiation....


Sealing Electrical Connectors: When is it Worth Moving Up to Ceramic?

November 21, 2007 5:42 am | Wireless Design & Development | Product Releases | Comments

Ceramic-to-metal seals have a number of properties that allow for a more robust, durable hermetic seal and better electrical insulation than glass-to-metal seals. Morgan Advanced Ceramics (MAC) Range of Options When engineers design a seal for feedthroughs and other electrical connectors, four general classes of material are evaluated....

LISTED UNDER: Interconnect, Connectors | Ceramics

Alumina Ceramic Components

November 8, 2007 7:41 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers miniature, dry-pressed alumina ceramic components from its GBC Materials Division. Manufactured in outer dimensions ranging from 0.020” to 2”, the ceramic materials provide a cost-effective solution for demanding applications. Designed for miniature electronic devices, these small pressed alumina components are suitable for use in telecommunications, appliance and electronic applications....


Compact Multilayer Capacitors for RF Applications

September 26, 2007 8:17 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics (MEC) launches its 10 mm square, type 106 RF multi-layer ceramic capacitor that offers high capacitance and performance in a small unit volume, providing operation for a variety of high RF voltage and high RF current applications. These capacitors are made from a low loss modified magnesium titanate ceramic and internal electrodes which, when sintered under controlled conditions, form a monolithic and hermetically se...


Selecting Miniature Passive Components for WiMAX and WLAN Applications

August 8, 2007 7:50 am | Wireless Design & Development | Product Releases | Comments

When exploring passive component options, asking the right questions upfront can ensure the correct component is selected for your design. By Michael Dakhiya, Chris Reynolds, Kevin Christian, Avital Yaish, AVX Corporation 1. Basic design steps for selecting the correct standard passive component In a wireless world, consumers have come to expect smaller, faster, and more sophisticated electronic/electrical products from equipment ma...

LISTED UNDER: Passives, Capacitors | Ceramics

Online Prototype Quantities

December 30, 2005 7:16 am | Wireless Design & Development | Product Releases | Comments

American Technical Ceramics (ATC) announces expanded product offerings for ATC QUIKBuy™, where customers may place online orders for small product quantities. ATC QUIKBuy offers the EIA-size ultra-low ESR capacitors, the 600F (0805) and 600S (0603). The company has now expanded its online product offerings to include the 600L (0402), as well as 100A (0505) and 100B (1111) capacitors....


Atmel and Tower Semiconductor Announce Joint CMOS Image Sensor Technology and Product Development Agreement

August 3, 2005 6:35 am | Wireless Design & Development | Product Releases | Comments

Atmel® Corporation and Tower Semiconductor Ltd. announce that they have agreed on a CMOS image sensor technology development partnership. Atmel and Tower will work together to design and develop process technology predominantly to be used in consumer products. Under the agreement, both companies have rights to use the jointly developed technology....


Multilayer Cofired Ceramic Design Guide

February 4, 2005 10:49 am | Wireless Design & Development | Product Releases | Comments

AdTech Ceramics has published a design guide for advanced electronic packages produced with co-fire multi-layer ceramic technology. Typical applications include multi-chip modules, microwave packages, high frequency feed-throughs, crystal packages, custom pin grid arrays, and ceramic/metal packages....


Piezoelectric and Dielectric Ceramics

November 23, 2004 11:15 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics introduces its piezoelectric ceramic, PZT807 and dielectric ceramic, D34. The PZT807 offers high performance and superior power handling capabilities. It is suited for sensing technology and ultrasonic transmitter systems. The dielectric ceramic, D34, is suited for high-performance base station cavity filters in wireless and radio systems....



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