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New Adhesive from DELO Cures at Temperatures as Low as 60°C

Thu, 07/24/2014 - 10:27am
WDD Staff

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DELO (Windach, Germany) now offers a special heat-curing adhesive that cures to full strength in temperatures as low as 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging applications, where several temperature-sensitive materials are bound together. Technical specifications include:

  • 48 hour processing time.
  • Storage life: four months at -18°C.
  • Can be dispensed through needles with a diameter as small as 200 µm.

For more information, visit www.delo-adhesives.com.

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