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New Low Profile, Quick Release Interconnect from Amphenol Offers High Performance

Fri, 05/02/2014 - 8:42am
WDD Staff

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Amphenol Industrial Global Operations (Sidney, NY) has introduced a low profile, quick release, high power interconnect using Amphenol’s new R4 RADSOK technology, which provides low insertion and extraction forces with a high mating cycle rating for high power interconnects, making it perfect for frequent mating applications. R4 RADSOK can be used as a battery interconnect both internally (cell-to-cell) and externally (battery-to-battery or array-to-power storage units); in electric vehicles, hybrid electric vehicles and fuel cell electric vehicles as well as in servers connecting power to the board. Additional features include:

  • A lower voltage drop.
  • A maximized contact surface.
  • A reduced temperature rise.
  • An impact resistant design. 
  • A push and click installation.
  • A maximum current rating of 400A.
  • A maximum DC voltage rating of 1,000 V.

For more information, please visit www.amphenol-industrial.com.

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