Modular Mission Computer from Elma Easily Provides Custom I/O
Elma Electronic Inc. (Fremont, CA) now offers the compact F-Series PCIe/104 Platform, a fanless, rugged mission computing platform that combines a configurable structure with Intel's 4th generation Quad or Dual Core processor.
Using custom I/O panels, expandable sidewall modules, and a host of application-specific PC104e I/O expansion cards, the F-Series Platform can be easily modified to take on additional I/O including video compression and frame grabbers, ARINC and 1553 cards, Ethernet and Ethernet switching, plus FPGA and GPGPU processing.
By combining a suite of high speed I/O with a high performance HD4600 graphics engine, the F-Series enables quality performance for applications including radar and sonar processing; image signal processing; hyperspectral imaging; tactical command and control; surveillance and reconnaissance in defense; transportation, mining and industrial applications.
The rugged system platform incorporates a thermally conductive base as well as ribbed sidewalls and fins to provide convection and conduction cooling for superior thermal management. The mission computer, which can withstand external temperatures of -40° to +70°C, is designed to meet MIL-STD-810F, ensuring reliable performance in high shock and vibration applications.
Offered in three different modular chassis sizes to fit different configuration environments, Elma's new F-Series Platform ensures optimal performance while meeting SWaP requirements.
The F-Series PCIe/104 Platform's base board configuration supports:
- Intel's 4th generation Quad or Dual Core processor.
- Up to 8 GB DDR3.
- Type 1 Bottom-Stacking PCIe/104 with Gen2 PCIe x1 Lanes and Gen3 PEG x16.
- SATA with RAID capability.
- 2x Gigabit Ethernet ports.
- 2x RS232 COM ports.
- 13x USB 2.0 total, 2x USB 3.0, backward USB 2.0 compatible.
- Onboard audio and video for three independent displays.
- Discrete 16-bit GPIO Port.
- PCI Express Mini Card 1.2 Socket.
For more information visit elma.com.