Advertisement
Product Releases
Advertisement

Agilent Acquires Electrothermal Analysis Technology from Gradient Design Automation

Thu, 05/15/2014 - 9:37am
WDD Staff

Agilent Technologies [NYSE: A] (Santa Clara, CA) has announced its acquisition of electrothermal analysis technology from Gradient Design Automation (Palo Alto, CA), the maker of HeatWave electrothermal analysis software. Agilent EEsof EDA now has sole ownership of Gradient’s core technology and will serve customers of both the integrated Advanced Design System software solution and Gradient’s HeatWave solution. 

The electrothermal analysis technology allows designers to identify and correct thermal problems during integrated circuit development.

“Thermal management is one of the toughest challenges facing modern IC designers,” said Todd Cutler, general manager of Agilent EEsof EDA. “That’s why our integrated ADS electrothermal solution was so well received by customers following its introduction and has already been adopted by several major RFIC/MMIC vendors. Today’s announcement further reinforces our commitment to continue working to solve this difficult challenge for our customers.”

The acquisition stems from a cooperative agreement between Agilent and Gradient that began in 2012, when a version of Gradient’s technology was integrated into the ADS software as part of a comprehensive multitechnology solution for RFIC and MMIC development. In 2013, Agilent announced an expanded business relationship with Gradient that included increased financial commitment on Agilent’s part in exchange for increased access to Gradient’s electrothermal analysis technology. 

“The growth of Gradient’s business is proof that the unique software technology we created is highly effective at solving an important industry problem,” said Ed Cheng, president of Gradient. “We are quite pleased and excited that Agilent... will now carry the technology forward and work to further expand its market reach.”

Features of Agilent's ADS software include:

  • Complete schematic capture and layout environment.
  • Direct, native access to 3D planar and full 3D EM field solvers.
  • Largest number of process design kits (PDKs).
  • EDA and Design Flow Integration with companies such as Cadence, Mentor, and Zuken.
  • Optimization Cockpit for real-time feedback and control when using any of 12 optimizers.
  • X-parameter model generation from circuit schematic and Agilent's NVNA for nonlinear high-frequency design.
  • Up-to-date Wireless Libraries enable design and verification of the latest emerging wireless standards.

For more information visit agilent.com.

Advertisement

Share this Story

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading