Durable, Low Pressure Overmolded Backshell Cable Assemblies
API Technologies (Orlando, FL) now offers durable, low pressure overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. This simplified backshell design is readily available and more cost-effective than its metal counterpart. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer:
- Improved reliability.
- Simplified specification process.
- Superior strain relief, designed to withstand high temperatures and harsh environments.
- Improved insulation between conductors and the conductor shell.
For more information, visit www.apitech.com.