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Durable, Low Pressure Overmolded Backshell Cable Assemblies

Tue, 03/18/2014 - 7:48pm
WDD Staff

API Technologies (Orlando, FL) now offers durable, low pressure overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. This simplified backshell design is readily available and more cost-effective than its metal counterpart. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer:

  • Improved reliability.
  • Simplified specification process.
  • Superior strain relief, designed to withstand high temperatures and harsh environments.
  • Improved insulation between conductors and the conductor shell.

For more information, visit www.apitech.com.

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