Fujitsu Introduces Grounding Springs for Mobile Devices
Fujitsu Components America (Sunnyvale, CA) has released a new series of grounding springs featuring a patented, robust structure and a wide working range for use in emerging mobile devices. The FCN-118X grounding spring series is designed to provide frame grounding between the pc board and chassis of smart phones, tablet PCs, PDAs and other small mobile devices. A side-wing structure increases the spring’s rigidity and strength to resist deformation from applied outside force. Other specifics include:
- Measures 1.4 x 3.7 mm.
- 4A power contact between pc boards.
- Initial height of 2.05mm.
- Displacement of 0.80mm.
- Working range of 1.25 to 1.80mm.
- Contact force of 0.5 to 1.6N.
- Custom designs.
For more information, please visit us.fujitsu.com/components