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Fujitsu Introduces Grounding Springs for Mobile Devices

Mon, 02/03/2014 - 9:20am
WDD Staff

LISTED UNDER:

Fujitsu Components America (Sunnyvale, CA) has released a new series of grounding springs featuring a patented, robust structure and a wide working range for use in emerging mobile devices. The FCN-118X grounding spring series is designed to provide frame grounding between the pc board and chassis of smart phones, tablet PCs, PDAs and other small mobile devices. A side-wing structure increases the spring’s rigidity and strength to resist deformation from applied outside force. Other specifics include:

  • Measures 1.4  x 3.7 mm.
  • 4A power contact between pc boards.
  • Initial height  of 2.05mm.
  • Displacement of 0.80mm.
  • Working range of 1.25 to 1.80mm.
  • Contact force of 0.5 to 1.6N.
  • Custom designs.

For more information, please visit us.fujitsu.com/components

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