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Fujitsu’s Ultra-Compact Bluetooth Low Energy Modules use Nordic Semiconductor’s Ultra-Low Power SoC

Mon, 01/13/2014 - 2:28pm
WDD Staff

With increasing OEM development of compact and low-cost Bluetooth low energy (BLE) devices and accessories, Fujitsu Components (Sunnyvale, CA) has introduced a new family of ultra-compact, BLE modules based on the Nordic Semiconductor nRF51822 System-on-Chip (SoC). The modules provide an economical means for developers to reduce their time-to-market. Features include:

  • Two versions: A 10.5 x 9.2 x 1.6 mm surface-mount module without antenna, and a 15.7 x 9.8 x 2.0 mm surface-mount module with antenna.
  • Bluetooth V4.0 single-mode compliant—modules allow OEMs to quickly develop tiny, power-conscious and cost-efficient Bluetooth Smart consumer devices.
  • Built-in MCU, which allows adding upper layer profiles including private profiles and application code.

For more information, visit www.us.fujitsu.com

 

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