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New Low Profile, Quick Release Interconnect from Amphenol

Wed, 09/25/2013 - 1:01pm
WDD Staff

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Amphenol Industrial Global Operations (Sidney, NY) has introduced a low profile, quick release, high power interconnect using Amphenol’s new R4 RADSOK technology.  The new RADLOK product line provides low insertion and extraction forces with a high mating cycle rating for high power interconnects, making it perfect for frequent mating applications.
 
This high performance connection system:

  • Features a versatile, low profile, right angle design
  • Is ideal for use in the automotive, heavy equipment, power/battery storage, hybrid-electric system, power interconnect, and factory automation markets.
  • Has an integrated positive mechanical lock/release feature which enhances cycle durability.
  • Lowers voltage drop.
  • Maximizes contact surface.
  • Reduces temperature rise.
  • Features a rugged, low-profile over mold design, making it impact resistant.
  • Is a preassembled 1 piece over mold connector that helps to reduce end user assembly costs.
  • Features color-coded connectors for visual identification.
  • Is easy to install with a simple push and click.
  • Is RoHS compliant.
  • Offers a maximum current rating of  400 A.
  • Offers a maximum DC voltage rating of 1,000 V.
  • Offers an operating temperature range of -40º to +125ºC. 


Amphenol’s cost-effective RADLOK product line can be used as a battery interconnect both internally (cell-to-cell) and externally (battery-to-battery or array-to-power storage units); it can be used in electric vehicles, hybrid electric vehicles, and fuel cell electric vehicles as well as in servers connecting power to the board. RADLOCK is available in either crimp-on versions or integrated directly onto cable with customizable lug end configurations.
 
For more information, please visit http://www.amphenol-industrial.com

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