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Molex VITA 66.1 Optical MT Backplane Interconnect System

Tue, 03/26/2013 - 11:35am
WDD Staff

Molex Incorporated (Lisle, IL) has launched the VITA 66.1 ruggedized optical MT backplane interconnect solution for high-density military, aerospace, and commercial embedded system applications. Features include:

  • Availability with 8, 12, or 24 fibers in standard singlemode or multimode and VersaBeam (expanded beam) MT ferrule options for design flexibility.
  • A robust aluminum housing.
  • An operating temperature range from  -50° to +105°C.
  • ANSI-ratified 66.1 compliance.

For more information visit www.molex.com.

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