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Fujipoly’s New Form-in-Place Thermal Compound

Tue, 03/05/2013 - 10:52am
WDD Staff

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Fujipoly (Carteret, NJ) has announced the introduction of SARCON SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to .50 mm in height. Features include:

  • No required heat curing.
  • A temperature range of -40° to + 150C).
  • A thermal conductivity of 2.0 W/m°K.
  • A thermal resistance of only 2.1°C cm2/W.
  • Excellent vibration absorption.

For more information visit http://www.fujipoly.com.

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