Fujipoly’s New Form-in-Place Thermal Compound
Fujipoly (Carteret, NJ) has announced the introduction of SARCON SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to .50 mm in height. Features include:
- No required heat curing.
- A temperature range of -40° to + 150C).
- A thermal conductivity of 2.0 W/m°K.
- A thermal resistance of only 2.1°C cm2/W.
- Excellent vibration absorption.
For more information visit http://www.fujipoly.com.