CTS Heat Sinks with Low Thermal Resistance
CTS Electronic Components, Incorporated (Elkhart, IN) [NYSE: CTS] has announced a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. Features include:
- Applicability for BGA, PGA, PLCC, QFP, and other IC packages.
- A low-profile, thin fin design.
- A height that ranges from 6.3 to 32.6 mm.
- A thermal resistance of 1.9°C/W @ 200 LFPM convection flow conditions.
- An adhesive tape or clip to help attach to integrated circuits.
- A shear strength @ 100°C is 36 psi.
For more information visit http://www.ctscorp.com/components.