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CTS Heat Sinks with Low Thermal Resistance

Tue, 02/26/2013 - 10:02am
WDD Staff

LISTED UNDER:

CTS Electronic Components, Incorporated (Elkhart, IN) [NYSE: CTS] has announced a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. Features include:

  • Applicability for BGA, PGA, PLCC, QFP, and other IC packages.
  • A low-profile, thin fin design.
  • A height that ranges from 6.3 to 32.6 mm.
  • A thermal resistance of 1.9°C/W @ 200 LFPM convection flow conditions.
  • An adhesive tape or clip to help attach to integrated circuits.
  • A shear strength @ 100°C is 36 psi.

For more information visit http://www.ctscorp.com/components.

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