CTS Electronic Components, Incorporated (Elkhart, IN) [NYSE: CTS] has announced a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. Features include:

• Applicability for BGA, PGA, PLCC, QFP, and other IC packages.
• A low-profile, thin fin design.
• A height that ranges from 6.3 to 32.6 mm.
• A thermal resistance of 1.9°C/W @ 200 LFPM convection flow conditions.
• An adhesive tape or clip to help attach to integrated circuits.
• A shear strength @ 100°C is 36 psi.

For more information visit http://www.ctscorp.com/components.