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BGA Packages Minimize Size, Weight, and Power

Wed, 11/28/2012 - 6:49am

Data Device Corporation (DDC) introduces Mil-Temp versions of its Micro-ACE TE and Total-ACE MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations. The Micro-ACE TE terminals integrate 1553 protocol, memory, and transceivers in a small plastic BGA package that is lightweight and small-sized to save board space, weight, and power. The Total-ACE further integrates 1553 transformers to offer a complete solution for one dual redundant MIL-STD-1553 channel.

Benefits include:
• Operating Temperature: -55ºC to +125ºC
• Minimize SWaP (Size, Weight, and Power)
    o Small Footprint Saves Board Space and Decreases Weight
    o Low Power Dissipation
• DO-254 Certifiable
    o Field Proven and Reliable Technology with over 200 Million Hours of In-Service History
• Supports MIL-STD-1553 A/B, MIL-STD-1760, STANAG 3838, and MacAir

For more information, visit www.ddc-web.com.

 

 

November 28, 2012

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