New Aries CSP Sockets Enable Testing of Any Area-Array Device to +200 Degrees C
High-temp sockets useful in military, aerospace and geophysical applications
Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry’s first CSP sockets that accept any area-array device for high-temperature testing up to +200°C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.
For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now incorporate cost-effective and high-reliability CSP socket technology to test and burn-in virtually any area-array device at temperatures up to +200°C. The sockets are successfully employed in military, aerospace and geophysical environments as well as in research and development.
The AR4HT sockets accommodate a variety of area-array devices including BGA, LGA, QFN, DFN, CSP, MLCC and POP as well as bumped die with full and partial arrays. Full socket operating temperature is -55°C to +200°C with a life expectancy of more than 10,000 actuations. The socket can accommodate IC devices with a pitch of 0.4 mm or greater as well as mixed pitch environments.
The interposer set is comprised of silver particles within a silicon elastomer with a patented polyimide core. Initial contact force is 20 to 30 grams per lead.
As with all Aries test and burn-in sockets, the new AR4HT series is available in custom sizes and configurations to suit specific customer applications.
Pricing for an AR4HT socket starts at $175. Delivery is 20 work days ARO.
For additional information, please visit www.arieselec.com.
Posted by Ron M. Seidel, Editorial Intern
April 18, 2012