Product Releases

New Aries CSP Sockets Enable Testing of Any Area-Array Device to +200 Degrees C

Wed, 04/18/2012 - 6:42am

High-temp sockets useful in military, aerospace and geophysical applications

Aries - CSP SocketsAries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry’s first CSP sockets that accept any area-array device for high-temperature testing up to +200°C.  The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.

For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now incorporate cost-effective and high-reliability CSP socket technology to test and burn-in virtually any area-array device at temperatures up to +200°C.  The sockets are successfully employed in military, aerospace and geophysical environments as well as in research and development. 

The AR4HT sockets accommodate a variety of area-array devices including BGA, LGA, QFN, DFN, CSP, MLCC and POP as well as bumped die with full and partial arrays.  Full socket operating temperature is -55°C to +200°C with a life expectancy of more than 10,000 actuations. The socket can accommodate IC devices with a pitch of 0.4 mm or greater as well as mixed pitch environments.

The interposer set is comprised of silver particles within a silicon elastomer with a patented polyimide core.  Initial contact force is 20 to 30 grams per lead.

As with all Aries test and burn-in sockets, the new AR4HT series is available in custom sizes and configurations to suit specific customer applications.

Pricing for an AR4HT socket starts at $175.  Delivery is 20 work days ARO.

For additional information, please visit

Posted by Ron M. Seidel, Editorial Intern

April 18, 2012


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