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New Corner Design Optimizes Part Rigidity for Improved Shielding Performance

Thu, 09/16/2010 - 8:03am
Laird Technologies, Inc. today announced the release of its new rigid corner board-level shield (BLS).

Being the only company on the market offering this proprietary shield design, Laird Technologies’ rigid corner board-level shield incorporates a new corner design that optimizes component rigidity for increased part and printed circuit board (PCB) firmness. As PCB designers are increasingly using thinner substrates, a rigid frame reinforces the assembly, thereby improving overall ruggedness and performance.

The shield has improved solder joint reliability and resistance to solder joint fracture, especially in drop testing performance with thin PCBs. Several standard Laird Technologies EMI style parts including single-piece, two-piece, and multi-compartmental board-level shields now use this new rigid corner design, along with availability in custom sizes as well.

The new shield is stronger and more robust than traditional drawn shields, which results in coplanarity improvement of the solder castellations. The shield can tolerate more deflection (i.e., more handling) without plastic deformation. Elimination of drawn flange reduces the space needed on the PCB for shielding trace width by potentially ~0.3 mm, allowing for the shield to be more closely placed on the PCB. Elimination of draft allows for more undershield space and improved component clearance.

The partially drawn corner is located near the top portion the shield, resulting in improved torsional rigidity with no drawn lip and no draft. For parts over 2 mm, the corner is both drawn and formed with an interlocking multi-radius corner, which provides superior EMI shielding effectiveness. The interlocking corner can be meshed and closed in during the forming & drawing process for additional improved rigidity for parts taller than 2 mm. For parts under 2 mm, the entire corner is drawn without an interlocking corner.

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