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Environment-Friendly Material Options for the CPLD Family Now Available

Tue, 09/21/2010 - 11:48am
Lattice Semiconductor Corporation announces the availability of halogen- and lead-free packages for its ispMACH® 4000ZE CPLD family, a popular programmable logic solution for high-volume consumer electronics. Bromine and chlorine, halogens associated with ozone depletion, have been replaced with metal oxides or red phosphorous.

Lead and halogens have been eliminated from several components of the ispMACH 4000ZE IC package material to comply fully with industry standards such as Japan’s JEIDA and Europe’s WEEE. For lead-frame based packages, the plating process has been modified to remove lead, and halogens have been removed from die-attach and mold compounds that encapsulate the IC.

Lattice has qualified a wide variety of package types in lead-free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Chip Array BGA (caBGA), Flip Chip BGA (fcBGA), and Quad Flat-pack Saw-singulated (QFNS). Lattice’s lead-free packages offer the same high quality and reliability benefits as devices that contain lead.

All TQFP package variations and the 64-Ball csBGA package of the ispMACH 4000ZE family are now halogen free and use pure tin (Sn 100%) for lead plating.

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