Product Releases

SiliconBlue Ships Highest Logic Capacity FPGA in 6x6 mm Footprint Package

Mon, 08/23/2010 - 11:17am
SANTA CLARA, Calif. -- (BUSINESS WIRE )-- SiliconBlue® Technologies today announced immediate availability of two new device packages for its iCE65™ mobileFPGA™ family. The iCE65L01 device with 1,280 logic cells is now offered in a 5x5 mm, 81-ball BGA package with 63 user I/O pins, and the iCE65P04 device with 3,520 logic cells is now offered in a 6x6 mm, 121-ball BGA package with 95 user I/O pins.

Today’s mobile designers face a daunting challenge. They must deliver a new mobile handset with innovative and differentiating features every year. Unfortunately, today’s application processors take approximately 2 to 3 years to develop and may still not include the functions the designer needs. In addition, these new features require plentiful logic coupled with additional I/O, which the application processor may not offer.

By using SiliconBlue’s iCE65 mobileFPGA devices, designers can add new features to their mobile handset by complementing their existing applications processor, enabling fast innovation in the highly competitive mobile market.

The iCE65L01F-TCB81 and the iCE65P04F-TCB121 are available immediately in volume production.


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