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Industry’s First 3G and LTE SAW-less Transceiver

Fri, 06/04/2010 - 10:28am
Fujitsu Microelectronics America, Inc. (FMA) introduces the industry’s first transceiver that supports 3GPP LTE/WCDMA/EGPRS wireless phones.

The Fujitsu MB86L10A transceiver eliminates 3G and LTE TX and RX interstage SAW filters and low-noise amplifiers (LNAs). The single-chip transceiver features backward compatibility with a high-level programming model (API) for radio control using DigRF/MIPI D3G and D4G open standard digital interfaces. This makes the new MB86L10A compatible with a wide range of industry basebands.

The compact module enables cell phone manufacturers to reduce component count, board space and total bill of materials. Its simplified programming model significantly reduces development time and simplifies integration of the RF in a radio platform. The transceiver, which is optimized for compressed mode operation, features quad-band GSM/EDGE and up to five WCDMA or LTE bands in a single-phone configuration.

The MB86L10A includes eight outputs that directly drive the power amplifier, eliminating the need for TX SAW filters while simultaneously supporting advanced multimode PAs. The receiver provides nine inputs that support LTE, WCDMA and GSM/EDGE. The new RF frontend eliminates the need for LNAs and SAW filters. Five additional ports enable RX diversity in WCDMA and LTE modes. The receiver also incorporates anti-aliasing filters, digital channel filters, digital gain control and high-dynamic-range ADCs.

The MB86L10A supports GSM (GSM850, EGSM900, DCS1800, PCS1900), WCDMA (Bands I, II, III, IV, V, VI, VIII, IX, X and XI) and LTE (FDD Bands 1, 3, 4, 6, 7, 8, 9, 10, 11, 13, 17 and TDD band 38 or 40). The transceiver includes dual 3G and 4G DigRF interfaces to the baseband IC to support the latest as well as legacy generations of basebands, SPI and/or GPOs control PAs, switching regulators and antenna switches. A microcontroller in the transceiver simplifies timing and control.

Samples of the MB86L10A manufactured in 90nm CMOS process technology are available now in 230-pin, 6.5 mm x 9.0 mm x 0.9 mm LGA packages. Volume pricing is available upon request.

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