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Chipset Software Supports picoChip Femtocell Test

Wed, 06/09/2010 - 7:51am
Agilent Technologies Inc. and picoChip announce a high-volume manufacturing test solution for 3G femtocell products. The jointly developed solution is based on picoChip’s picoXcell semiconductors and software, and Agilent’s N7310A chipset software. The new integrated manufacturing test solution delivers rapid calibration and verification testing capabilities for original design manufacturers (ODMs) and contract manufacturers (CMs).

“Agilent’s N7310A chipset control software provides OEMs, module manufacturers and design houses with a reliable and efficient test solution,” said Garrett Lees, applications marketing manager at Agilent’s Microwave and Communications Division. “This solution speeds up product development and the production lifecycle and ensures the fastest time to market.”

“Cellular network operators have recognized femtocells as a key enabling technology as they try to keep up with burgeoning user demand for data services,” said David Maidment, VP of product management, picoChip. “Bringing a consumer market approach to the network infrastructure business is not an easy transition. This new manufacturing test solution is a key part of our ability to provide the proven, fully tested solutions that the market requires.”

Agilent N7300 software solutions are supported on the Agilent MXA, EXA, MXG and ESG analyzers and signal generators. To ensure investment protection, the software, used in design, verification and manufacturing, is compatible with Agilent’s X-series applications and test hardware.

picoChip’s PC6201 manufacturing bundle is an open-systems-based support package for the company’s picoXcell femtocell solutions. The bundle includes a SCPI-based manufacturing interface, controlling test PHY and a radio application-programming interface. The new solution supports a full RF manufacturing test calibration and verification test plan.

The bundle, which supports all the major 3G femtocell deployments to date, is optimized for picoChip’s PC3xx SoCs and builds on technology already proven in manufacturing environments.

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