Silicone-Free Interface Material Provides High Thermal Conductivity
Wed, 02/25/2009 - 10:46am
MH&W International introduces Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices. U 90 material consists of a ceramic-filled polyurethane film with thermal conductivity of 6 W/mK and thermal impedance of 0.05 Kin.²/W. The material has a high voltage breakdown property of 4 kV, and it provides strong perforation protection with a tensile strength of 2.5 N/mm² and a Shore A hardness of 70. Typical applications include medical devices, laser equipment, lighting systems, solar energy, disc drives and aerospace electronics. The material is available in 0.10 and 0.20 mm thicknesses (3.90 and 7.80 mil).