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Flush-Fitting Hinged Trims

March 27, 2015 3:06 pm | by WDD Staff | Comments

OKW has added a new size to its SMART-BOX range of advanced sealed plastic enclosures for industrial electronics: 5.12” x 8.66” x 2.36”. SMART-BOX is designed to enhance the aesthetics and ergonomics of industrial electronics such as HVAC, control and safety systems ...

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Multi-Port, Multi-Protocol

March 27, 2015 1:40 pm | by WDD Staff | Comments

ACCES I/O Products has announced a new family of mini PCI Express (mPCIe) multi-port serial communication cards — the mPCIe-COM Series ...

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Low Pin Count Package

March 27, 2015 1:37 pm | by WDD Staff | Comments

The FT600Q and FT601Q are FTDI Chip’s (UK) first generation USB 3.0 products that function as SuperSpeed USB 3.0 to FIFO bridges, providing data bursting rates of up to 3.2 Gbps ...

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Dual Channel Adaptive IF Relay

March 27, 2015 1:30 pm | by WDD Staff | Comments

Pentek has introduced the Model 71624 dual channel, 34 signal, adaptive IF (intermediate frequency) relay XMC with a Virtex-6 FPGA. As an IF relay, it accepts two IF analog input channels, modifies up to 34 signals, and then delivers them to two analog IF outputs. Any signal within each IF band can be independently enabled or disabled ...

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Universal Input

March 26, 2015 3:25 pm | by WDD Staff | Comments

Polytron Devices’ new UI10 series of 10 Watt, single and dual output AC-DC power supply modules deliver 75 percent power supply efficiency in 2.5" x 1.75" x .75" fully encapsulated plastic cases. Additional features include ...

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Green-Power Initiative

March 26, 2015 3:12 pm | by WDD Staff | Comments

Skyworks  introduces a step-down, DC-DC converter for automotive, distributed power, industrial, and medical applications that features ...

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Stable Electrical Parameters

March 26, 2015 3:05 pm | by WDD Staff | Comments

AVX has introduced the new TCR Professional Series tantalum chip capacitors with conductive polymer electrodes. Designed for use in high power DC-DC converters employed in telecommunications, industrial, and avionics applications that demand high reliability and long lifetime performance, TCR Professional Series capacitors are subjected to AVX’s maverick part control Q-Process with statistical screening ...

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Smart PIR Sensor for Smart Home Applications

March 26, 2015 9:31 am | by WDD Staff | Comments

GreenPeak Technologies has announced a new addition to its Smart Home portfolio with the launch of a reference design for a low cost Passive Infra-Red (PIR) sensor with outstanding performance ...

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5-Bit Attenuator Reaches 31 GHz

March 25, 2015 5:35 pm | by RFMW, Ltd. | RFMW, Ltd. | Comments

RFMW, Ltd. announces design and sales support for a 5-bit digital attenuator spanning 1-31 GHz. The Qorvo TGL2223-SM offers a 0.5 dB least significant bit (LSB) providing 15.5 dB of overall attenuation range. The TGL2223-SM is packaged in a ceramic, air-cavity QFN measuring 3 x 3 x 1.45 mm. Useful in applications such as point-to-point radio, SatCom, EW and radar, the Qorvo TGL2223-SM has measurably ...

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New Digital Printing Service For Front Panels And Enclosures

March 24, 2015 12:46 pm | Comments

OKW’s metal enclosures division METCASE is pioneering the use of digital printing for front panels, rack cases and instrument housings – saving customers time and money. METCASE’s new state of the art digital technology means legends, logos and complex photo quality graphics can be printed on front panels and enclosures quickly and easily. METCASE can print in full ... 

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Durable Conductive Foam Gaskets for EMI Shielding Attenuation

March 20, 2015 10:26 am | by WDD Staff | Comments

Available as standard gaskets, custom designs or sheet stock, durable 2700 Series Conductive Foam has X, Y and Z axis conductivity for maximum EMI shielding attenuation. The material is ideal for computer, router and telecom I/O shielding. It is offered ... 

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Wafer Processing Adhesive (WPA) for Thin Wafer Processing

March 20, 2015 9:33 am | by AI Technology, Inc. (AIT) | Comments

Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. AI Technology, Inc (AIT) is proud to be the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. Leveraging its expertise manufacturing film ... 

MiniRF Low-Cost Splitters Support Broadband CATV

March 19, 2015 4:19 pm | by RFMW, Ltd. | RFMW, Ltd. | Comments

RFMW, Ltd. announces design and sales support for MiniRF’s low cost, 2-way splitter, model MRFSP0014. Covering the CATV bandwidth of 5 to 1002MHz, the MRFSP0014 is designed for applications that require small, low cost and highly reliable surface mount components. Typical insertion loss is 0.5dB with isolation of 30dB. Amplitude balance measures ... 

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New Vishay Intertechnology 20 V Chipscale MOSFET

March 18, 2015 11:59 am | by Vishay Intertechnology | Comments

Vishay Intertechnology has introduced a new TrenchFET 20 V n-channel MOSFET designed to save space, decrease power co ...

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40GHz Edge Connector Enhances PCB Performance

March 17, 2015 2:33 pm | by RFMW, Ltd. | RFMW, Ltd. | Comments

RFMW, announces design and sales support for the Rosenberger 02K243-40ME3, 2.92 mm female, clamp-on, PCB edge launch connector. Perfect for prototyping or production design where frequencies up to 40 GHz are required, this Rosenberger connector is compatible with SMA and 3.5 mm connectors. The 02K243-40ME3 body is brass with gold over nickel plating and the center contact is beryllium copper ...

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