Test/Burn-in Socket Accommodates 6.5 mm² Devices
Fri, 09/05/2008 - 5:47am
Aries Electronics’ CSP/MicroBGA test and burn-in socket accommodates CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices up to 6.5 mm². The device lasts up to 500,000 cycles over a temperature range from -55°C to 150°C (-67°F to 302°F). The socket offers solderless pressure mount compression spring probes and a pressure pad compression spring, which have contact forces of 15 g per contact on 0.30 to 0.35 mm pitches, 16 g per contact on 0.40 to 0.45 mm pitches, 25 g per contact on 0.50 to 0.75 mm and 0.80 mm pitches or larger. The spring probes are heat-treated beryllium copper alloy plated with 30 μ min. (0.75 μ) gold per Mil-G-45204 over 30 μ min. (0.75 μm) nickel per SAE-AMS-QQ-N-290, the molded components are UL94V-0 Ultem, the machined components are UL94V-0 PEEK or Torlon, and the hardware is stainless steel.