Thermal Pad Increases Thermal Conductivity
Fri, 08/01/2008 - 8:29am
Laird Technologies’ T-flex™ 700 thermal pad increases the thermal conductivity to 5 W/mK and exhibits a low shore OO hardness value of 50. The RoHS-compliant gap filler comes in thickness ranges from 0.04” to 0.20” (1 to 5 mm) in increments of 0.01” (0.25 mm) and is available in standard sheets or die cut parts for custom specification with an option to have adhesive only on one side. The pad is appropriate for applications such as notebook and desktop computers, wireless base stations and radio heads, servers and LED lighting, amongst others.