Technology Shrinks Quad-band EDGE PA Modules by 50%
Thu, 04/03/2008 - 12:21pm
TriQuint Semiconductor, Inc. announces the first two members of its HADRON II PA Module family: the TQM7M5012 and TQM7M5005. These second-generation EDGE PAs were designed using the company’s CuFlip copper bump technology, improving RF performance while reducing current consumption to provide longer device battery life. Debuting with a 5 × 5 mm footprint, these solutions are 50% smaller than the previous generation, providing handset manufacturers additional board space to add other rich features. Available in EDGE-Polar and EDGE-Linear versions, both products have been optimized to deliver best-in-class current consumption in the critical GMSK mode, which significantly improves handset battery life. The TQM7M5012 for EDGE-Polar applications is aligned with Qualcomm’s newest 3G multimode transceivers. Compared to the previous generation, TQM7M5012 offers even lower Rx band noise power level to help eliminate external components in the radio.