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Method for Converting Device Packages

Wed, 09/26/2007 - 8:17am
Advanced Interconnections introduces BGA interposers, which are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, interposers solve BGA device transition, obsolescence and solderability issues associated with the higher temperature requirements to process lead-free BGA packages. Advanced's turn-key solution consists of lead-free BGA device attach to an interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.

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