High Throughput Automated Gold Bumper
Wed, 09/26/2007 - 12:05pm
Palomar Technologies introduces its model 8000 gold ball bumper that incorporates advanced mechanical design, control architecture and graphical user interface to provide a high net throughput and flexibility. It features dual wafer stages, an improved operator interface and an LCD programming screen. This single process co-planar gold bumper produces planarized gold bumps in one step, using a bond-head motion to form precise gold bumps by repeatedly shearing the wire off the top of the bump without leaving a tail. This allows the formation of flat bumps, eliminating the need for a secondary coining process. Set-up time and fixturing are minimized by "soft tooling" achieved with Windows-based software which enables changes in ball array, position and shapes to match the desired attach process.