Product Releases

Adoption of Digital Co-design Technology

Tue, 07/31/2007 - 11:19am
Cadence Design Systems, Inc. announces that Faraday has adopted Cadence® system-in-package (SiP) digital co-design technology. This technology strengthens Faraday's substrate design capability and enables the company to provide SiP implementation capability to the market. Today's fabless design companies are striving to shorten their design cycle times by prototyping as early as possible in the development stage. Cadence SiP digital co-design technology is seamlessly integrated with Cadence Encounter® technology to deliver compatibility with the chip design teams' IC flow, as well as provide compliance with the IC technology file.


Share this Story

You may login with either your assigned username or your e-mail address.
The password field is case sensitive.