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Open Interface North America Signs MOU with Murata Manufacturing

Tue, 02/27/2007 - 7:34am
Open Interface North America, a leading provider of Bluetooth® wireless applications, and Murata Manufacturing Corp., headquartered in Kyoto, Japan, and a global leader in the design, manufacture and sale of ceramic-based passive electronic components and modules, announces the signing of a Memorandum of Understanding with the intent to collaborate on next-generation Bluetooth audio applications by integrating Open Interface software and Murata hardware solutions. Specifically, Murata has agreed to the implementation of Open Interface's SOUNDabout Bluetooth Audio Software in the Murata Bluetooth audio module. The Open Interface SOUNDabout solution will be integrated with the Murata module, which uses a chipset from Broadcom.

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