Product Releases

Automatic Die Bonder

Wed, 09/06/2006 - 10:54am

Palomar Technologies announces the Model 3500-III, an automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. The 3500-III is capable of performing automated eutectic die attach utilizing backside metalized die or preforms, and enables bonding of thin die with air bridges, using 2 or 4 sided perimeter collets. Palomar’s patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control.

Palomar Technologies


Share this Story

You may login with either your assigned username or your e-mail address.
The password field is case sensitive.