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Inspection Tool

Thu, 06/02/2005 - 7:23am
Bede announces the BedeScan™ digital X-ray inspection tool for high-speed identification and quantification of structural defects in semiconductor wafer substrates and epilayers up to 300 mm in diameter. BedeScan uses non-destructive X-ray diffraction (XRD) to identify a range of anomalies in both incoming and processed wafers, including thermal slip dislocations, edge damage and other crystallographic defects. BedeScan is suited for high-volume manufacturing applications, delivering quantitative data that enables in-line statistical control of manufacturing processes. BedeScan allows for imaging of wafers in both reflection and transmission modes, providing information about crystallographic defects in the surface region and bulk of wafers. Digital image processing permits efficient measurement routines of selected regions only.
Bede
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