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Chip-on-Glass

Thu, 06/30/2005 - 8:30am

The 128x64 COG version offers a construction that is 6 mm thick, including an LED backlight The design includes an FPC interface for easy mating with standard ZIF-type connectors. The removing of metallic bezels and bulky PCB results in weight reduction for portable devices. The display features contrast ratios of 9:1 and extended temperature ranges from – 20° C to +70° C.


CSTN Canada


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